Reflow profiling


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26/04/2021

Brief description

A thorough study of the reflow profile, its parts and requirements. It takes a closer look at the progression of the temperature over time. Maximum and minimum requirements, heating techniques, melting point, CTE, structure with solidification of the alloy, etc.

Subjects

  • Component types and forms
  • ESD environment and protection
  • Printing solder paste
  • Jetting and dispensing solder paste
  • Stencils
  • PC boards
  • Solder paste properties
  • Pick & Place
  • Component feeders
  • Creating reflow profiles
  • Measuring reflow profiles

Practical

Documentation is provided
Dates* 26/04/2021
Price on request
Location in our Smans Technology Center or at your company
Number of participants max. 8
Participant level basic prior knowledge SMD recommended
Target group newly recruited personnel or personnel from other departments who want to acquire basic knowledge

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