Stencil printing SMT
advanced
Brief description
A complete overview of printing solder paste in a typical SMT stencil printer. It describes the different movements, their mutual relationship and the materials used. Terms such as fine-pitch, stencil thickness, stepped stencils, laser cut, etc. are explained
Subjects
- Relationship of the parameters
- Stencil material
- Stencil structure
- Apertures
- Reduction
- Alignment
- Solder mask
- Print gap
- Support
- Squeegee material
- Squeegee angle
- USC
- Pin-in paste
Practical
| Documentation | is provided |
|---|---|
| Dates* | 13/05/2021 |
| Price | on request |
| Location | in our Smans Technology Center or at your company |
| Number of participants | max. 8 |
| Participant level | basic prior knowledge SMD recommended |
| Target group | experienced personnel |
* Would you prefer a different date? Contact us via the form and we will look into the possibilities.
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