Stencil printing SMT
advanced
Brief description
A complete overview of printing solder paste in a typical SMT stencil printer. It describes the different movements, their mutual relationship and the materials used. Terms such as fine-pitch, stencil thickness, stepped stencils, laser cut, etc. are explained
Subjects
- Relationship of the parameters
- Stencil material
- Stencil structure
- Apertures
- Reduction
- Alignment
- Solder mask
- Print gap
- Support
- Squeegee material
- Squeegee angle
- USC
- Pin-in paste
Practical
Documentation | is provided |
---|---|
Dates* | 13/05/2021 |
Price | on request |
Location | in our Smans Technology Center or at your company |
Number of participants | max. 8 |
Participant level | basic prior knowledge SMD recommended |
Target group | experienced personnel |
* Would you prefer a different date? Contact us via the form and we will look into the possibilities.
