Become a process expert in Stencilprinting!

In this webinar we will discuss the topic Stencilprinting:

→ How to avoid mistakes in an SMD assembly process
→ What are the most important parameters and conditions
→ What does scooping, slump, printgap and release have to do with stencilprinting
→ Interflux discusses the types of solder paste, the pre-mixing and handling process

This webinar is only in Dutch, please contact us if you want more information in your language.

Become a process expert in Selective Soldering!

In this webinar we will discuss the topic Selective Soldering:

→ How to make a good solder joint
→ What influence do soldering speed, soldering height, choice of nozzle, flux and alloy have
→ Interflux discusses with you the types of fluxes and the need for adapted fluxes

This webinar is only in Dutch, please contact us if you want more information in your language.

Become a process expert in BGA Rework!

In this webinar we will discuss the topic BGA Rework:

→ How to desolder a defective BGA from a printed circuit board
→ How to clean and prepare the PCB to insert a new BGA
→ How to apply flux or paste
→ Which fluxes can be used, what are their characteristics, advantages and disadvantages
→ Which temperature profiles can be used and what do you need to consider
→ Interflux looks together with you at the types of fluxes, pastes, dip pastes, etc.

This webinar is only in Dutch, please contact us if you want more information in your language.

The World of Labeling and Marking

A while ago, we organised a virtual journey through the four worlds of cable and wire processing. In a series of four webinars, we discussed exciting topics and offered a clear view of the possibilities.

Do you want to know how to take your production processes of Labeling & Marking to the next level?

Then watch this webinar and get an overview of the machines of the future that will help you meet your challenges!

This webinar is only in Dutch, please contact us if you want more information in your language.

The World of Cutting, Stripping and Shrinking

A while ago, we organised a virtual journey through the four worlds of cable and wire processing. In a series of four webinars, we discussed exciting topics and offered a clear view of the possibilities.

Do you want to know how to take your production processes of Cutting, Stripping & Shrinking to the next level?

Then watch this webinar and get an overview of the machines of the future that will help you meet your challenges!

This webinar is only in Dutch, please contact us if you want more information in your language.

The World of Crimping, Connecting & Quality

A while ago, we organised a virtual journey through the four worlds of cable and wire processing. In a series of four webinars, we discussed exciting topics and offered a clear view of the possibilities.

Do you want to know how to take your production processes of crimping, connecting & quality to the next level?

Then watch this webinar and get an overview of the machines of the future that will help you meet your challenges!

This webinar is only in Dutch, please contact us if you want more information in your language.

The World of Automation and Applications

A while ago, we organised a virtual journey through the four worlds of cable and wire processing. In a series of four webinars, we discussed exciting topics and offered a clear view of the possibilities.

Do you want to know how to take your production processes of Automation & Applications to the next level?

Then watch this webinar and get an overview of the machines of the future that will help you meet your challenges!

This webinar is only in Dutch, please contact us if you want more information in your language.

Pin-hole ratio: What is the influence on liquid tin and what ratio is ideal?

Pin-hole ratio

With through hole components, the connection pins go through a PCB. The space between a connecting pin and the hole in the PCB will determine the capillary effect. This effect ensures that the flux and liquid tin are ‘sucked’ up into the space between the pin and the hole.

A good pin to hole ratio is therefore one of the crucial parameters in the successful soldering of through hole components.

Control of the capillary effect

It is important that first the flux capillary is ‘sucked’ up into the hole so that the surfaces of the hole and the pin can be made oxide-free so that the soldering tin in turn can rise optimally.

To get the strongest capillary effect, the open area between the pin and hole must be between 150 µm and 350 µm.

The use of N2 has a positive influence on the capillary action and is particularly important in selective soldering. Also in wave soldering an N2 atmosphere has a favourable effect on the rising of the solder in the holes.

More info?

Leave your details via the contact form and we will contact you as soon as possible!

– Written by Bart van de Lisdonk