The melting points of typical lead free solder alloys are situated in the 217 to 227°C range, depending the ratio of the main alloy’s metals; Sn, Ag and Cu. In comparison with the old tin-lead (SnPb) alloys these melting points of standard lead-free alloys are 40 to 50°C higher. For a number of components and...

Miniaturization of electronic devices and components is a real trend. Designers are constantly working on the edge of the physical limits of manufacturability. As a result of this the apertures in stencils are always getting smaller. Who still remembers the times that a chip component of 2 by 3mm was really small? Nowadays components of...

More purchasing and production closer to home give us more security and make us independent of a few superpowers. But what about the cost price? Aren’t they much higher given the high labour costs in Western Europe?     To be able to compete in this reshoring, we need to “use the necessary hands as optimally...

In times when energy is very precious and we have to take care of nature, it pays to take a closer look at your existing soldering processes for SMD / SMT components. The vapour phase process offers a perfect alternative with the advantage of requiring up to 75% less electrical power.     In this whitepaper...

The global supply chain of electronic components has been under enormous pressure for some time now.   Components are hard to get and prices are skyrocketing. Experts say that we should not delude ourselves too much that this issue will resolve itself in the near future. This is because the need for a microchip, for example, is...

A product that has recently been in remarkable short supply in the cable and wire processing sector is the wire end sleeve or ferrule. Insulated end sleeves offer additional protection when processing electronic conductors. The plastic housing provides additional stability and durability for electronic applications with vibrations or shocks. An indispensable product for machine builders or OEMs! Unfortunately,...

In this webinar we will discuss the topic Stencilprinting: → How to avoid mistakes in an SMD assembly process → What are the most important parameters and conditions → What does scooping, slump, printgap and release have to do with stencilprinting → Interflux discusses the types of solder paste, the pre-mixing and handling process This...

In this webinar we will discuss the topic Selective Soldering: → How to make a good solder joint → What influence do soldering speed, soldering height, choice of nozzle, flux and alloy have → Interflux discusses with you the types of fluxes and the need for adapted fluxes This webinar is only in Dutch, please...

In this webinar we will discuss the topic BGA Rework: → How to desolder a defective BGA from a printed circuit board → How to clean and prepare the PCB to insert a new BGA → How to apply flux or paste → Which fluxes can be used, what are their characteristics, advantages and disadvantages...

A while ago, we organised a virtual journey through the four worlds of cable and wire processing. In a series of four webinars, we discussed exciting topics and offered a clear view of the possibilities. Do you want to know how to take your production processes of Labeling & Marking to the next level? Then watch this...

A while ago, we organised a virtual journey through the four worlds of cable and wire processing. In a series of four webinars, we discussed exciting topics and offered a clear view of the possibilities. Do you want to know how to take your production processes of Cutting, Stripping & Shrinking to the next level? Then watch...

A while ago, we organised a virtual journey through the four worlds of cable and wire processing. In a series of four webinars, we discussed exciting topics and offered a clear view of the possibilities. Do you want to know how to take your production processes of crimping, connecting & quality to the next level? Then watch...

A while ago, we organised a virtual journey through the four worlds of cable and wire processing. In a series of four webinars, we discussed exciting topics and offered a clear view of the possibilities. Do you want to know how to take your production processes of Automation & Applications to the next level? Then watch this...

Pin-hole ratio With through hole components, the connection pins go through a PCB. The space between a connecting pin and the hole in the PCB will determine the capillary effect. This effect ensures that the flux and liquid tin are ‘sucked’ up into the space between the pin and the hole. A good pin to...

Halogens in a flux Halogens are chemical elements that have the property of reducing metals efficiently. In the process, metal salts are formed that are usually very soluble in water and also attract and retain moisture from the environment. Moisture and metal salts together create an electrically conductive medium. This significantly increases the chance of electromigration...

Voiding A phenomenon that occurs in the reflow soldering process. Bubbles (voids) begin to form in the flowed and solidified solder which make the solder joint hollow to a certain extent. Cause of voiding The cause of this phenomenon can be found in the outgassing of substances used in the various components, materials and PCBs....

Tombstoning A situation that occurs during the reflow soldering process, especially in a vapour phase or vapour phase reflow system. It means that passive chip components such as resistors and condensers stand upright during soldering.   The cause of tombstoning     The cause of this problem is to be found in the accidental flow of solder paste on the two...