Description
ASSCON Vapor-Phase-Reflow-Soldering Systems set the benchmark in soldering technology. The physical laws of the process permit defect-free soldering of the most complicated SMT assemblies in any required geometry even when using lead-free solder pastes. Components such as QFPs, BGAs, Flip-Chips as well as hybrids are processed with very high quality results. The VP 510 Series is designed to be used in the laboratory and for prototype production. Due to its compact design and optionally an integrated cooling unit the machine may be used at any place and without preparatory set-up even at different workplaces. With an integrated closed cooling system installed only a 240 V / 120 V supply connection is required to operate the unit. Machine design concept The machine is impressive due its simplicity, ease of use and providing the ability to solder high quality assemblies defect-free. Integrated in the self-supporting structure is the process zone with electrically operated lift-unit and the work piece carrier. The electronic control includes temperature sensors for the heaters, fluid and steam temperatures and therefore ensures absolute process reliability. An automatic measuring cycle recognizes the prozess fluid used. The machine is delivered with an automatic monitoring of the process fluid level by default. The whole process can be observed through a sight window. A quick start function reduces energy consumption during stand by mode and guarantees operational readiness for the next solder cycle within the shortest time. Process sequence After opening the machine cover the solder product is placed on a work piece carrier. The process starts. An electric motor moves the work piece carrier with the assemblies to be soldered into soldering position. The PLC controls vapor production according to the set temperature gradients. Having reached the soldering temperature the work piece carrier is moved to the cooling position. The inner lock between process and cooling zone closes. The solder product is cooled by an effective blower system. After the cooling time has expired, a signal indicates release for removing of the work piece. An electromechanical guard locking prevents from opening the machine during production process.
Specifications
Type | |
---|---|
Length (mm) | |
Width (mm) | |
Height (mm) | |
Weight (kg) | |
Power | |
Compressed air | |
Min. PCB length (mm) | |
Min. PCB width (mm) | |
Max. PCB length (mm) | |
Max. PCB width (mm) | |
Inline | |
Baking function |
ASSCON Vapor-Phase-Reflow-Soldering Systems set the benchmark in soldering technology. The physical laws of the process permit defect-free soldering of the most complicated SMT assemblies in any required geometry even when using lead-free solder pastes. Components such as QFPs, BGAs, Flip-Chips as well as hybrids are processed with very high quality results. The VP 510 Series is designed to be used in the laboratory and for prototype production. Due to its compact design and optionally an integrated cooling unit the machine may be used at any place and without preparatory set-up even at different workplaces. With an integrated closed cooling system installed only a 240 V / 120 V supply connection is required to operate the unit. Machine design concept The machine is impressive due its simplicity, ease of use and providing the ability to solder high quality assemblies defect-free. Integrated in the self-supporting structure is the process zone with electrically operated lift-unit and the work piece carrier. The electronic control includes temperature sensors for the heaters, fluid and steam temperatures and therefore ensures absolute process reliability. An automatic measuring cycle recognizes the prozess fluid used. The machine is delivered with an automatic monitoring of the process fluid level by default. The whole process can be observed through a sight window. A quick start function reduces energy consumption during stand by mode and guarantees operational readiness for the next solder cycle within the shortest time. Process sequence After opening the machine cover the solder product is placed on a work piece carrier. The process starts. An electric motor moves the work piece carrier with the assemblies to be soldered into soldering position. The PLC controls vapor production according to the set temperature gradients. Having reached the soldering temperature the work piece carrier is moved to the cooling position. The inner lock between process and cooling zone closes. The solder product is cooled by an effective blower system. After the cooling time has expired, a signal indicates release for removing of the work piece. An electromechanical guard locking prevents from opening the machine during production process.
Type | |
---|---|
Length (mm) | |
Width (mm) | |
Height (mm) | |
Weight (kg) | |
Power | |
Compressed air | |
Min. PCB length (mm) | |
Min. PCB width (mm) | |
Max. PCB length (mm) | |
Max. PCB width (mm) | |
Inline | |
Baking function |