Asscon – VP510

Asscon – VP510

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    • Independent expertise
    • Customers give us a 9+
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    • More than 45 years of experience

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    Worry-free investing through business leasing

    Do you want to expand or replace your machine park? This is possible via Smans. Consider a manual, semi-automatic machine or a fully automated production line. We work together with reliable leasing partners. They offer flexible and reliable tailor-made business financing solutions. 

    We always first identify the value of your project and your objectives.

    Thanks to our expertise, we offer our leasing partners a lot of clarity. They can therefore make a better risk assessment than standard providers

    The benefits of leasing through Smans:

    • financial space/maintenance of liquid assets;
    • for both large and small investments;
    • promote your growth and increase your capacity;
    • strengthen your competitive position through an up-to-date machine park.

    Do you want to know what business leasing can do for your company? Contact team Smans.

      Would you like to know what business leasing could mean for your project? Our sales team will be happy to answer all your questions!


      • Independent expertise
      • Customers give us a 9+
      • Extensive offer
      • More than 45 years of experience

      Contact us

      In need direct contact with a sales representative?

      Nick Janssen

      Product specialist

        Or leave your details and we will contact you as soon as possible.

        • Independent expertise
        • Customers give us a 9+
        • Extensive offer
        • More than 45 years of experience
        • Independent expertise
        • Customers give us a 9+
        • Extensive offer
        • More than 45 years of experience
        SKU: 46118 Categories: ,

        Description

        ASSCON Vapor-Phase-Reflow-Soldering Systems set the benchmark in soldering technology. The physical laws of the process permit defect-free soldering of the most complicated SMT assemblies in any required geometry even when using lead-free solder pastes. Components such as QFPs, BGAs, Flip-Chips as well as hybrids are processed with very high quality results. The VP 510 Series is designed to be used in the laboratory and for prototype production. Due to its compact design and optionally an integrated cooling unit the machine may be used at any place and without preparatory set-up even at different workplaces. With an integrated closed cooling system installed only a 240 V / 120 V supply connection is required to operate the unit. Machine design concept The machine is impressive due its simplicity, ease of use and providing the ability to solder high quality assemblies defect-free. Integrated in the self-supporting structure is the process zone with electrically operated lift-unit and the work piece carrier. The electronic control includes temperature sensors for the heaters, fluid and steam temperatures and therefore ensures absolute process reliability. An automatic measuring cycle recognizes the prozess fluid used. The machine is delivered with an automatic monitoring of the process fluid level by default. The whole process can be observed through a sight window. A quick start function reduces energy consumption during stand by mode and guarantees operational readiness for the next solder cycle within the shortest time. Process sequence After opening the machine cover the solder product is placed on a work piece carrier. The process starts. An electric motor moves the work piece carrier with the assemblies to be soldered into soldering position. The PLC controls vapor production according to the set temperature gradients. Having reached the soldering temperature the work piece carrier is moved to the cooling position. The inner lock between process and cooling zone closes. The solder product is cooled by an effective blower system. After the cooling time has expired, a signal indicates release for removing of the work piece. An electromechanical guard locking prevents from opening the machine during production process.

        Specifications

        Type
        Length (mm)
        Width (mm)
        Height (mm)
        Weight (kg)
        Power
        Compressed air
        Min. PCB length (mm)
        Min. PCB width (mm)
        Max. PCB length (mm)
        Max. PCB width (mm)
        Inline
        Baking function

        ASSCON Vapor-Phase-Reflow-Soldering Systems set the benchmark in soldering technology. The physical laws of the process permit defect-free soldering of the most complicated SMT assemblies in any required geometry even when using lead-free solder pastes. Components such as QFPs, BGAs, Flip-Chips as well as hybrids are processed with very high quality results. The VP 510 Series is designed to be used in the laboratory and for prototype production. Due to its compact design and optionally an integrated cooling unit the machine may be used at any place and without preparatory set-up even at different workplaces. With an integrated closed cooling system installed only a 240 V / 120 V supply connection is required to operate the unit. Machine design concept The machine is impressive due its simplicity, ease of use and providing the ability to solder high quality assemblies defect-free. Integrated in the self-supporting structure is the process zone with electrically operated lift-unit and the work piece carrier. The electronic control includes temperature sensors for the heaters, fluid and steam temperatures and therefore ensures absolute process reliability. An automatic measuring cycle recognizes the prozess fluid used. The machine is delivered with an automatic monitoring of the process fluid level by default. The whole process can be observed through a sight window. A quick start function reduces energy consumption during stand by mode and guarantees operational readiness for the next solder cycle within the shortest time. Process sequence After opening the machine cover the solder product is placed on a work piece carrier. The process starts. An electric motor moves the work piece carrier with the assemblies to be soldered into soldering position. The PLC controls vapor production according to the set temperature gradients. Having reached the soldering temperature the work piece carrier is moved to the cooling position. The inner lock between process and cooling zone closes. The solder product is cooled by an effective blower system. After the cooling time has expired, a signal indicates release for removing of the work piece. An electromechanical guard locking prevents from opening the machine during production process.

        Type
        Length (mm)
        Width (mm)
        Height (mm)
        Weight (kg)
        Power
        Compressed air
        Min. PCB length (mm)
        Min. PCB width (mm)
        Max. PCB length (mm)
        Max. PCB width (mm)
        Inline
        Baking function