Saki – BF-3Si-LD2

3D L size dual lane inspection of solderpaste in superb efficiency and accuracy

Saki – BF-3Si-LD2

3D L size dual lane inspection of solderpaste in superb efficiency and accuracy

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      • Independent expertise
      • Customers give us a 9+
      • Extensive offer
      • More than 45 years of experience

      Contact us

      In need direct contact with a sales representative?

      Nick Janssen

      Product specialist

        Or leave your details and we will contact you as soon as possible.

        • Independent expertise
        • Customers give us a 9+
        • Extensive offer
        • More than 45 years of experience
        • Independent expertise
        • Customers give us a 9+
        • Extensive offer
        • More than 45 years of experience
        SKU: 46281 Categories: ,
        3D L size dual lane inspection of solderpaste in superb efficiency and accuracy

        Description

        Solder paste is applied during the printing process and is necessary to attach the components to a circuit board to assure the proper electrical connection. The printing process has become extremely complex due to today’s circuit board configurations that pack very small components into extremely tight spaces. Over 50% of circuit board defects are rooted in problems related to solder paste printing. To accurately determine the accuracy of the printing process, 3D solder paste inspection has become a requirement.

        Specifications

        Type
        Length (mm)
        Height (mm)
        Weight (kg)
        Power
        Compressed air
        Min. PCB length (mm)
        Min. PCB width (mm)
        Max. PCB length (mm)
        Max. PCB width (mm)
        Inline
        PCB Clearance Top (mm)
        PCB Clearance Bottom (mm)
        Resolution camera head (µm)

        Solder paste is applied during the printing process and is necessary to attach the components to a circuit board to assure the proper electrical connection. The printing process has become extremely complex due to today’s circuit board configurations that pack very small components into extremely tight spaces. Over 50% of circuit board defects are rooted in problems related to solder paste printing. To accurately determine the accuracy of the printing process, 3D solder paste inspection has become a requirement.

        Type
        Length (mm)
        Height (mm)
        Weight (kg)
        Power
        Compressed air
        Min. PCB length (mm)
        Min. PCB width (mm)
        Max. PCB length (mm)
        Max. PCB width (mm)
        Inline
        PCB Clearance Top (mm)
        PCB Clearance Bottom (mm)
        Resolution camera head (µm)