Description
The SM485 is a wide range chip mounter that allows high-speed placement of small components as well as precise placement of odd-shaped components. With 4 sets of high-speed, wide-use spindles and 1 set of precision spindle with back-light system and force control function ,SM485 can place components from 0402 chips up to o 55 (L150 x W25 x H26mm) components.
As an option, it is applicable to PCBs with sizes up to L740 x W460 (weight: 4.5kg).
In addition, by applying various additional functions such as component verification, traceability,etc., it provides an all-in-one solution that allows high quality placement and management of components from chips to odd-shaped components without adding an extra expensive machine.
– Spindle/Gantry : 4+1Spindles/1Gantry
– Speed : 22,000CPH
– Parts : 0402~□21mm(H 15mm)/Fly – □55mm(H 26mm)/Stage – L150mmx25mm
– Accuracy: ±40㎛@±3σ/Chip – ±30㎛@±3σ/QFP
– Max.PCB : L460xW400 (Standard)/L740xW460 (Max)
– Force Control head (Option)
– Gripper nozzle (Option)
– Backlight and Laser Lighting (Option)
Specifications
Type | |
---|---|
Length (mm) | |
Width (mm) | |
Height (mm) | |
Weight (kg) | |
Power | |
Compressed air | |
Inline | |
Dual lane | |
CPH | |
Piano head | |
Turret head | |
Max. comp height (mm) | |
Min. comp size (inch) | |
Max. comp size | |
Feeder position (8mm) | |
Placement accuracy chip | |
Spindles | |
Gantrys | |
Force control | |
Electrical test | |
Dispensing | |
Min. Cross-section (mm²) | |
Max. Cross-section (mm²) | |
Max. outside diameter (mm) |
The SM485 is a wide range chip mounter that allows high-speed placement of small components as well as precise placement of odd-shaped components. With 4 sets of high-speed, wide-use spindles and 1 set of precision spindle with back-light system and force control function ,SM485 can place components from 0402 chips up to o 55 (L150 x W25 x H26mm) components.
As an option, it is applicable to PCBs with sizes up to L740 x W460 (weight: 4.5kg).
In addition, by applying various additional functions such as component verification, traceability,etc., it provides an all-in-one solution that allows high quality placement and management of components from chips to odd-shaped components without adding an extra expensive machine.
– Spindle/Gantry : 4+1Spindles/1Gantry
– Speed : 22,000CPH
– Parts : 0402~□21mm(H 15mm)/Fly – □55mm(H 26mm)/Stage – L150mmx25mm
– Accuracy: ±40㎛@±3σ/Chip – ±30㎛@±3σ/QFP
– Max.PCB : L460xW400 (Standard)/L740xW460 (Max)
– Force Control head (Option)
– Gripper nozzle (Option)
– Backlight and Laser Lighting (Option)
Type | |
---|---|
Length (mm) | |
Width (mm) | |
Height (mm) | |
Weight (kg) | |
Power | |
Compressed air | |
Inline | |
Dual lane | |
CPH | |
Piano head | |
Turret head | |
Max. comp height (mm) | |
Min. comp size (inch) | |
Max. comp size | |
Feeder position (8mm) | |
Placement accuracy chip | |
Spindles | |
Gantrys | |
Force control | |
Electrical test | |
Dispensing | |
Min. Cross-section (mm²) | |
Max. Cross-section (mm²) | |
Max. outside diameter (mm) |