Product detail
Saki – BF-3Si-LS2
3D L size single lane inspection of solderpaste in superb efficiency and accuracy
Read moreSolder paste is applied during the printing process and is necessary to attach the components to a circuit board to assure the proper electrical connection. The printing process has become extremely complex due to today’s circuit board configurations that pack very small components into extremely tight spaces. Over 50% of circuit board defects are rooted in problems related to solder paste printing. To accurately determine the accuracy of the printing process, 3D solder paste inspection has become a requirement.
| Length | 1440 mm |
|---|---|
| Height | 1500 mm |
| Weight | 900 kg |
| Power | 240 V / 1 / N / PE - 50 Hz / 60 Hz |
| Compressed air | Yes |
| Min. PCB length | 50 mm |
| Min. PCB width | 60 mm |
| Max. PCB length | 500 mm |
| Max. PCB width | 510 mm |
| Inline | Yes |
| PCB Clearance Top | 40 mm |
| PCB Clearance Bottom | 60 mm |
| Resolution camera head | 7 | 12 | 18 µm |
100% functional testing wasn’t an option, Saki 3D AOI makes PCBA functional testing practically unnecessary
Since the beginning of 2018 BEA SA produces their own circuit boards, after outsourcing this to China for fifteen years. This was only possible of personnel costs were kept as low as possible. 100% functional testing of the electronics wasn’t possible to close the business case. Smans’ s advice to invest in Saki 3D AOI was an excellent choice. In the first period of production all circuit boards have been functionally tested…
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