Product detail


Saki – BF-X2 200 kV

3D Automated X-ray Inspection (AXI)

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Saki 3D AXI systems are based on Saki’s unique Planar Computed Tomography (PCT) technology that captures 3D images of slices of the board, package, or module and reconstructs them in real time in a high-speed production setting. The process completely separates the top and bottom-side images of the board, measures components and features, determines placement variance and warpage, identifies and classifies the defects, such as dry joints and voids, and generates the associated data. Saki’s automated high-resolution 3D X-ray inspection and measurement systems enable high image quality defect detection. The BF-X2 200kV system is dedicated for semiconductor and insulated gate bipolar transistor (IGBT) power module inspection.

Length1820 mm
Height1880 mm
Weight6500 kg
Power400 V / 3 / N / PE - 50 Hz / 60 Hz
Compressed airYes
Min. PCB length50 mm
Min. PCB width120 mm
Max. PCB length460 mm
Max. PCB width510 mm
InlineYes
PCB Clearance Top40 mm
PCB Clearance Bottom40 mm
Resolution camera head8 to 25 µm

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