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Ersa – Ersascope 2 (discontinued)


High end inspection system for BGA, µBGA, CSP, Flip Chip and other hidden solder joints. Product discontinued 08/2018.

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ERSASCOPE 2 – the complete solution for the inspection of BGA, CSP, Flip Chip, heel filling, THT throughput and other hidden solder joints

High end endoscope inspection system including three quick change heads:
– 90° BGA head (approx. 280 µm clearance)
– 90° Flip Chip head (approx. 30 µm clearance)
– 0° wide angle head, e.g. for VIA inspection without tilting of optics
7 movement axes for flexible adjustment to practically every required viewing angle
High-performance, dimmable LED lighting in daylight colour
High quality 1.3 megapixel CCD colour camera with USB connection
XY rotary table with fine adjust wheels, freely positionable under the optics

Optimal light management:
– inspection heads with fibre optic stereo front light
– mechanically coupled, swivelling and rotating backlight
– fibre optic gooseneck for targeted lighting from all sides
– separate setting of light quantity for all light guides
– with light brushes, light extension and iris aperture

Focusing scale to be used with calibration groups in the ImageDoc EXP measuring function
Complete set with the most important accessories and storage case

— Product discontinued —

Alternative product: Ersascope M

Depth520 mm
Width500 mm
Height400 mm

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