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Ersa – Ersascope 2 (discontinued)
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High end inspection system for BGA, µBGA, CSP, Flip Chip and other hidden solder joints. Product discontinued 08/2018.
Read moreERSASCOPE 2 – the complete solution for the inspection of BGA, CSP, Flip Chip, heel filling, THT throughput and other hidden solder joints
High end endoscope inspection system including three quick change heads:
– 90° BGA head (approx. 280 µm clearance)
– 90° Flip Chip head (approx. 30 µm clearance)
– 0° wide angle head, e.g. for VIA inspection without tilting of optics
7 movement axes for flexible adjustment to practically every required viewing angle
High-performance, dimmable LED lighting in daylight colour
High quality 1.3 megapixel CCD colour camera with USB connection
XY rotary table with fine adjust wheels, freely positionable under the optics
Optimal light management:
– inspection heads with fibre optic stereo front light
– mechanically coupled, swivelling and rotating backlight
– fibre optic gooseneck for targeted lighting from all sides
– separate setting of light quantity for all light guides
– with light brushes, light extension and iris aperture
Focusing scale to be used with calibration groups in the ImageDoc EXP measuring function
Complete set with the most important accessories and storage case
— Product discontinued —
Alternative product: Ersascope M
Depth | 520 mm |
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Width | 500 mm |
Height | 400 mm |
Page invests with Smans in a second Ersa selective soldering machine
At Page Electronica in Poperinge (Belgium) Smans has recently installed a second Ersa selective soldering machine. Two years after the installation of the first Versaflow, Page has chosen to invest in a machine with a double soldering module. Page will gain double capacity with this new Ersa Versaflow to be able to meet the increasing demand. Higher demand for selective soldering Page Electronica noticed that their customers are increasingly choosing selective soldering.…
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