{"id":3358,"date":"2023-09-22T11:29:33","date_gmt":"2023-09-22T11:29:33","guid":{"rendered":"https:\/\/smans.falkor.alcor.cloud\/?post_type=knowledgeportal&#038;p=3358"},"modified":"2023-09-22T11:39:55","modified_gmt":"2023-09-22T11:39:55","slug":"how-to-avoid-tombstoning-during-pcb-assembly","status":"publish","type":"knowledgeportal","link":"https:\/\/smans.com\/en\/knowledgebase\/how-to-avoid-tombstoning-during-pcb-assembly\/","title":{"rendered":"How to avoid tombstoning during PCB assembly"},"content":{"rendered":"<h2>Tombstoning<\/h2>\n<p>A situation that occurs during the reflow soldering process, especially in a vapour phase or vapour phase reflow system.<\/p>\n<p>It means that\u00a0<strong>passive chip components<\/strong>\u00a0such as resistors and condensers\u00a0<strong>stand upright<\/strong>\u00a0during soldering.<\/p>\n<p>&nbsp;<\/p>\n<h3>The cause of tombstoning<\/h3>\n<p>&nbsp;<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"alignleft wp-image-21062\" src=\"https:\/\/smans.com\/wp-content\/uploads\/\/Tombstoning-1-360x174.png\" sizes=\"auto, (max-width: 343px) 100vw, 343px\" srcset=\"https:\/\/smans.com\/wp-content\/uploads\/Tombstoning-1-360x174.png 360w, https:\/\/smans.com\/wp-content\/uploads\/Tombstoning-1-685x331.png 685w, https:\/\/smans.com\/wp-content\/uploads\/Tombstoning-1.png 870w\" alt=\"tombstoning PCB component op PCB bord\" width=\"343\" height=\"165\" \/><\/p>\n<p>&nbsp;<\/p>\n<p>The cause of this problem is to be found in\u00a0<strong>the accidental flow of solder paste<\/strong>\u00a0on the two contact ends of the component. When one of the two ends goes into liquid phase in front of the other, the liquid solder paste pulls the component upright.<\/p>\n<p>The\u00a0<strong>uneven thermal loading<\/strong>\u00a0of the connection surfaces of this component on the PCB is responsible for the\u00a0<strong>uneven flow<\/strong>.<\/p>\n<h3><\/h3>\n<p>&nbsp;<\/p>\n<h3>Methods of preventing tombstoning<\/h3>\n<p>There are a number of options to tackle this soldering defect. The most logical but also the most radical action is to\u00a0<strong>redesign the copper layers<\/strong>\u00a0in the PCB so that the thermal load on the soldering surfaces is equalised. This is a cumbersome task that requires access to the design files and specialised knowledge. In many cases this is not feasible for a subcontractor.<\/p>\n<p>Another option is at the level of stencil design. This adjusts the shape and position of the paste that is pressed onto the connection surfaces of the PCB. This requires a new stencil, specialised knowledge and often some testing.<\/p>\n<p>&nbsp;<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"wp-image-21065 alignleft\" src=\"https:\/\/smans.com\/wp-content\/uploads\/\/Tombstoning-2-360x70.png\" sizes=\"auto, (max-width: 447px) 100vw, 447px\" srcset=\"https:\/\/smans.com\/wp-content\/uploads\/Tombstoning-2-360x70.png 360w, https:\/\/smans.com\/wp-content\/uploads\/Tombstoning-2-1024x201.png 1024w, https:\/\/smans.com\/wp-content\/uploads\/Tombstoning-2-685x134.png 685w, https:\/\/smans.com\/wp-content\/uploads\/Tombstoning-2.png 1338w\" alt=\"\" width=\"447\" height=\"87\" \/><\/p>\n<p>&nbsp;<\/p>\n<p>One option that has the<strong>\u00a0least impact<\/strong>\u00a0on the production process and does not require specialised knowledge from the user is to adjust the solder paste so that it does not suddenly flow at a certain point but does so gradually, making the flow even and simultaneous.<\/p>\n<p>The\u00a0<strong>Interflux IF 9057 ATL<\/strong>\u00a0solder paste is a SAC305 \u2013 T4 paste with\u00a0<strong>anti-tombstone<\/strong>\u00a0function built in. It gives clear and minimal residue after soldering and is absolutely halogen free.<\/p>\n<p>&nbsp;<\/p>\n<p>&nbsp;<\/p>\n<hr \/>\n<h3>More info?<\/h3>\n<p>Leave your details via the<a href=\"https:\/\/smans.com\/contact\/\"><strong>\u00a0contact form<\/strong><\/a>\u00a0and we will contact you as soon as possible!<\/p>\n","protected":false},"featured_media":3359,"template":"","class_list":["post-3358","knowledgeportal","type-knowledgeportal","status-publish","has-post-thumbnail","hentry"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.1.1 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>How to avoid tombstoning during PCB assembly - Smans<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/smans.com\/nl\/knowledgeportal\/hoe-tombstoning-vermijden-tijdens-pcb-assemblage\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"How to avoid tombstoning during PCB assembly - Smans\" \/>\n<meta property=\"og:description\" content=\"Tombstoning A situation that occurs during the reflow soldering process, especially in a vapour phase or vapour phase reflow system. It means that\u00a0passive chip components\u00a0such as resistors and condensers\u00a0stand upright\u00a0during soldering. &nbsp; The cause of tombstoning &nbsp; &nbsp; The cause of this problem is to be found in\u00a0the accidental flow of solder paste\u00a0on the two...\" \/>\n<meta property=\"og:url\" content=\"https:\/\/smans.com\/nl\/knowledgeportal\/hoe-tombstoning-vermijden-tijdens-pcb-assemblage\/\" \/>\n<meta property=\"og:site_name\" content=\"Smans\" \/>\n<meta property=\"article:modified_time\" content=\"2023-09-22T11:39:55+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/smans.com\/wp-content\/uploads\/2023\/09\/TOMBSTONING.png\" \/>\n\t<meta property=\"og:image:width\" content=\"870\" \/>\n\t<meta property=\"og:image:height\" content=\"420\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/png\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data1\" content=\"2 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\/\/smans.com\/nl\/knowledgeportal\/hoe-tombstoning-vermijden-tijdens-pcb-assemblage\/\",\"url\":\"https:\/\/smans.com\/nl\/knowledgeportal\/hoe-tombstoning-vermijden-tijdens-pcb-assemblage\/\",\"name\":\"How to avoid tombstoning during PCB assembly - Smans\",\"isPartOf\":{\"@id\":\"https:\/\/smans.com\/nl\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\/\/smans.com\/nl\/knowledgeportal\/hoe-tombstoning-vermijden-tijdens-pcb-assemblage\/#primaryimage\"},\"image\":{\"@id\":\"https:\/\/smans.com\/nl\/knowledgeportal\/hoe-tombstoning-vermijden-tijdens-pcb-assemblage\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/smans.com\/wp-content\/uploads\/2023\/09\/TOMBSTONING.png\",\"datePublished\":\"2023-09-22T11:29:33+00:00\",\"dateModified\":\"2023-09-22T11:39:55+00:00\",\"breadcrumb\":{\"@id\":\"https:\/\/smans.com\/nl\/knowledgeportal\/hoe-tombstoning-vermijden-tijdens-pcb-assemblage\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/smans.com\/nl\/knowledgeportal\/hoe-tombstoning-vermijden-tijdens-pcb-assemblage\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\/\/smans.com\/nl\/knowledgeportal\/hoe-tombstoning-vermijden-tijdens-pcb-assemblage\/#primaryimage\",\"url\":\"https:\/\/smans.com\/wp-content\/uploads\/2023\/09\/TOMBSTONING.png\",\"contentUrl\":\"https:\/\/smans.com\/wp-content\/uploads\/2023\/09\/TOMBSTONING.png\",\"width\":870,\"height\":420},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/smans.com\/nl\/knowledgeportal\/hoe-tombstoning-vermijden-tijdens-pcb-assemblage\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\/\/smans.com\/en\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"How to avoid tombstoning during PCB assembly\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/smans.com\/nl\/#website\",\"url\":\"https:\/\/smans.com\/nl\/\",\"name\":\"Smans\",\"description\":\"\",\"publisher\":{\"@id\":\"https:\/\/smans.com\/nl\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/smans.com\/nl\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Organization\",\"@id\":\"https:\/\/smans.com\/nl\/#organization\",\"name\":\"Smans\",\"url\":\"https:\/\/smans.com\/nl\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\/\/smans.com\/nl\/#\/schema\/logo\/image\/\",\"url\":\"https:\/\/smans.com\/wp-content\/uploads\/2023\/09\/logo.svg\",\"contentUrl\":\"https:\/\/smans.com\/wp-content\/uploads\/2023\/09\/logo.svg\",\"caption\":\"Smans\"},\"image\":{\"@id\":\"https:\/\/smans.com\/nl\/#\/schema\/logo\/image\/\"}}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"How to avoid tombstoning during PCB assembly - Smans","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/smans.com\/nl\/knowledgeportal\/hoe-tombstoning-vermijden-tijdens-pcb-assemblage\/","og_locale":"en_US","og_type":"article","og_title":"How to avoid tombstoning during PCB assembly - Smans","og_description":"Tombstoning A situation that occurs during the reflow soldering process, especially in a vapour phase or vapour phase reflow system. 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