A phenomenon that occurs in the reflow soldering process.<\/p>\n
Bubbles (voids) begin to form in the flowed and solidified solder which make the solder joint hollow to a certain extent.<\/p>\n
The cause of this phenomenon can be found in the outgassing of substances used in the various components, materials and PCBs. However, the main cause of these voids, which are in fact gas bubbles, is the\u00a0solder paste used<\/strong>.<\/p>\n Solder paste consists of 2 main components, namely metal powder and flux. The flux contains resins and solvents, among other things, which all gas out when heated. When these gas bubbles have not left the liquid tin they become trapped in the solidified mass during the solidification of the solder. Especially in places under components it is extra difficult for the gases to escape because gases tend to move vertically.<\/p>\nHow to reduce voiding<\/h2>\n