Description

Flexible system concept The handling of VP 310 is remarkably easy and the oven provides every user with error-free soldering of top-quality electronic board assemblies. The flexibility is high for both the adjustment of soldering parameters of the board assembly and control of the process. Each individual step can be initiated manually when needed, such as board loading, modification of temperature gradient, activation of vapor generation and the start of the soldering procedure. The electronic control with its precise sensors for the heating element and the temperatures of the liquid and the vapor ensure fully secure operation. Visual process control is made possible by an inspection window. After the solder reflow is complete, the process is stopped by the operator or the oven-inherent function automatic solder break (ASB). After this, the content of the cooling water reservoir flows into the cooling coil and cools down the process medium so that the vapor blanket in the chamber disperses. Then, the oven can be opened safely for removing the soldered product. Optimum results The electronic board is heated up and soldered homogeneously, regardless of size and weight, using vapor as the medium for heat transfer. Consistently uniform heat energy is distributed across the entire PCB assembly, and even 3D assemblies can be processed easily and flawlessly.

Specifications