Convection Reflow Soldering System MRO250
FRI-903250
The MRO250 handle a board size of up to 350 x 250 mm and is easy to transport thanks to its low weight and handy dimensions.
Convection Reflow Soldering System MRO250
FRI-903250
The MRO250 handle a board size of up to 350 x 250 mm and is easy to transport thanks to its low weight and handy dimensions.
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Description
Batch solder system
Whether for prototype or series production: the batch soldering systems are the ideal solution for everyday use and combine simple handling with a low price. The user-friendly interface enables fast and uncomplicated programming of individual soldering programs in order to reduce set-up times to a minimum.
The MRO250 handle a board size of up to 350 x 250 mm and is easy to transport thanks to its low weight and handy dimensions.
Specifications
Dimensions | 590 x 260 x 430 mm |
Long-time process (e. g. b. cure adhesive) | 50 - 180°C, 1 - 300 min. |
Max. PCB size | 350 x 250 mm |
Preheating-temperature / time | 50 - 240°C, 1 - 3600 sec. |
Reflow-temperature / time | 75 - 320°C, 1 - 600 sec. |
Batch solder system
Whether for prototype or series production: the batch soldering systems are the ideal solution for everyday use and combine simple handling with a low price. The user-friendly interface enables fast and uncomplicated programming of individual soldering programs in order to reduce set-up times to a minimum.
The MRO250 handle a board size of up to 350 x 250 mm and is easy to transport thanks to its low weight and handy dimensions.