Saki - In-line automated 3D X-ray inspection system 3Xi-M110
IP-ef39e504
Inline 3D-CT Automated X-ray Inspection Systems
Saki - In-line automated 3D X-ray inspection system 3Xi-M110
IP-ef39e504
Inline 3D-CT Automated X-ray Inspection Systems
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Description
Saki’s high-resolution Planar CT technology, uniquely engineered for “Real 3D” Volumetric Inspection, discovers assembly defects that cannot be seen using external inspections alone.
The system contributes to quality improvements by accurately pinpointing diverse types of soldering and component defects.
Saki’s 3D-AXI (X-Ray) series adds significant inspection capability. The system utilizes Planar Computed Tomography (PCT) providing high precision CT imaging at high speed.
Saki’s unique “Planar CT” technology
– Acquires high-quality CT images of planar objects using fewer projections
– Identifies various defects in 3D images
Intuitive User-friendly software
– High accuracy true 3D automatic inspection
– Displays actual measurement and target point with 3D images
– Displays defects in high-precision 3D color images
Expands the range of inspection
– Inspection of standard PCBs, components and solder joints, and other electric components
– Head in Pillow (HIP)
– Detection and measurement of voids in multilayer PCB power modules.
Saki’s high-resolution Planar CT technology, uniquely engineered for “Real 3D” Volumetric Inspection, discovers assembly defects that cannot be seen using external inspections alone.
The system contributes to quality improvements by accurately pinpointing diverse types of soldering and component defects.
Saki’s 3D-AXI (X-Ray) series adds significant inspection capability. The system utilizes Planar Computed Tomography (PCT) providing high precision CT imaging at high speed.
Saki’s unique “Planar CT” technology
– Acquires high-quality CT images of planar objects using fewer projections
– Identifies various defects in 3D images
Intuitive User-friendly software
– High accuracy true 3D automatic inspection
– Displays actual measurement and target point with 3D images
– Displays defects in high-precision 3D color images
Expands the range of inspection
– Inspection of standard PCBs, components and solder joints, and other electric components
– Head in Pillow (HIP)
– Detection and measurement of voids in multilayer PCB power modules.