Ersa - Rework System HR 600P

ERS-0HR600P

Automated rework precision for the best results

Ersa - Rework System HR 600P

ERS-0HR600P

Automated rework precision for the best results

2 - 6 semaines
Prix ​​sur demande

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    • Expertise indépendante
    • Les clients nous donnent un 9+
    • Offre étendue
    • Plus de 50 ans d'expérience

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      • Expertise indépendante
      • Les clients nous donnent un 9+
      • Offre étendue
      • Plus de 50 ans d'expérience

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      Contact us

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      Nick Janssen

      Product specialist

        Or leave your details and we will contact you as soon as possible.


        • Expertise indépendante
        • Les clients nous donnent un 9+
        • Offre étendue
        • Plus de 50 ans d'expérience
        • Expertise indépendante
        • Les clients nous donnent un 9+
        • Offre étendue
        • Plus de 50 ans d'expérience

        Description

        With the HR 600P, Ersa is taking the next technological step in the professionalization and automation of repairing electronic assemblies. The solid and highly accurate machine frame forms the basis for precise component placement and reliability.

        Highlights HR 600P Ersa Rework

        • High-precision axis system, high-resolution cameras
        • Automated component placement as well as soldering and desoldering processes
        • Hybrid heating head with two heating zones
        • Process monitoring with reflow process camera
        • Large-area, powerful IR underheating with three zones
        • Three K-type thermocouple inputs for AccuTC sensor
        • Effective component cooling with compressed air
        • Optional residual solder removal with AUTO SCAVENGER (can also be retrofitted)

        Automatic residual solder removal for HR 600P

        Before a new component can be soldered onto a circuit board, the solder remaining on the circuit board after desoldering must be removed. In an automated process, the Auto Scavenger SC 600 gently removes the remaining solder from the connection surfaces on the PCB. The module can also be retrofitted and is fully integrated into the HRSoft 2 software.

        Why choose the HR 600P?

        • Full process control with HRSoft 2 & reflow camera
        • Contactless removal of residual solder (optional)
        • Accurate component placement to ±50 µm
        • Traceability of every process
        • Rework instead of replacement = sustainable & efficient

        Specifications

        Component size in mm:1 x 1 mm to 60 x 60 mm
        Dimensions (LxWxH) in mm:1,450 x 800 x 600
        PCB size in mm:up to 380 x 300 mm (+x)
        Rated power in W:3,200
        Required pressure:6-10 bar
        Weight in kg:110 kg (120 kg incl. SC 600)

        With the HR 600P, Ersa is taking the next technological step in the professionalization and automation of repairing electronic assemblies. The solid and highly accurate machine frame forms the basis for precise component placement and reliability.

        Highlights HR 600P Ersa Rework

        • High-precision axis system, high-resolution cameras
        • Automated component placement as well as soldering and desoldering processes
        • Hybrid heating head with two heating zones
        • Process monitoring with reflow process camera
        • Large-area, powerful IR underheating with three zones
        • Three K-type thermocouple inputs for AccuTC sensor
        • Effective component cooling with compressed air
        • Optional residual solder removal with AUTO SCAVENGER (can also be retrofitted)

        Automatic residual solder removal for HR 600P

        Before a new component can be soldered onto a circuit board, the solder remaining on the circuit board after desoldering must be removed. In an automated process, the Auto Scavenger SC 600 gently removes the remaining solder from the connection surfaces on the PCB. The module can also be retrofitted and is fully integrated into the HRSoft 2 software.

        Why choose the HR 600P?

        • Full process control with HRSoft 2 & reflow camera
        • Contactless removal of residual solder (optional)
        • Accurate component placement to ±50 µm
        • Traceability of every process
        • Rework instead of replacement = sustainable & efficient