Description

Maximum flexibility and optimum soldering quality are essential features of ASSCON stand-alone vapor phase soldering systems. By using workpiece carriers, these systems are excellently suited for small and large production quantities as well as for any design and size of assemblies.

Due to their compact design, the multi-chamber systems can find a place in almost any production. The conception as batch systems allows an island production. In this way, the system can be fed from a wide variety of production stations.

With the patented Multi Vacuum technology, voids in solder joints are reduced and void rates <1% are achievable. The vacuum module, which can be switched on during the process, is located outside the soldering area (Clean Vacuum Technology) and therefore requires very little maintenance.

Specifications