Asscon - Vapor Phase Soldering Machine VP7000-200 vacuum inline
ASSC-3170000
High-Performance inline systems for large series
Asscon - Vapor Phase Soldering Machine VP7000-200 vacuum inline
ASSC-3170000
High-Performance inline systems for large series
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Nick Janssen
Product specialist
Description
Full inline integration and no need for workpiece carriers, this is the focus of ASSCON´s vapor phase inline soldering systems. The simple transfer and takeover of PCBs via pin chains characterize this type of inline system. Electrically width-adjustable transport systems allow fast and uncomplicated adaptation to changing products and thus offer the flexibility required in today’s modern electronics production.
The integration into inline control computers is also possible. Full automation combined with the highest quality in the process is the guiding principle here.
With the patented Multi Vacuum technology, voids in solder joints are reduced and void rates <1% are achievable. The vacuum module, which can be switched on during the process, is located outside the soldering area (Clean Vacuum Technology) and is therefore extremely low in maintenance.
Specifications
| Transportation type | Single Lane |
| Maximum solder length | 155 mm - 520 mm (see details) |
| Maximum solder width | up to 450 mm |
| Maximum component height at top | 55 mm |
| Maximum component height below | 20 mm |
| Connection load | 21,1 kW |
| Average energy consumption | 4,7 kW |
| Time to operation | ca. 45 min |
| Loading 2 PCBs | up to 520 mm |
| Loading 3 PCBs | up to 335 mm |
| Loading 4 PCBs | up to 250 mm |
| Loading 6 PCBs | up to 155 mm |
| Option Longboard | up to 1.040 mm |
Downloads
Full inline integration and no need for workpiece carriers, this is the focus of ASSCON´s vapor phase inline soldering systems. The simple transfer and takeover of PCBs via pin chains characterize this type of inline system. Electrically width-adjustable transport systems allow fast and uncomplicated adaptation to changing products and thus offer the flexibility required in today’s modern electronics production.
The integration into inline control computers is also possible. Full automation combined with the highest quality in the process is the guiding principle here.
With the patented Multi Vacuum technology, voids in solder joints are reduced and void rates <1% are achievable. The vacuum module, which can be switched on during the process, is located outside the soldering area (Clean Vacuum Technology) and is therefore extremely low in maintenance.
| Type | Vapor Phase Soldering – Inline |
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