Asscon - Vapor Phase Soldering Machine VP810 batch / VP810 vacuum batch
ASSC-1181000
Stand-Alone systems for small series production, prototyping und labratory
Asscon - Vapor Phase Soldering Machine VP810 batch / VP810 vacuum batch
ASSC-1181000
Stand-Alone systems for small series production, prototyping und labratory
Contactez-nous
Besoin d'un devis, d'une installation ou d'une formation ?
Call +32 (0)14 42 44 01 or contactez nous
Nick Janssen
Product specialist
Description
The vapor phase soldering systems of the VP810-series are designed as compact Stand-alone-systems. They are particularly suitable for users, processing applications with frequently changing products in small-batch production. Due to the universal applicability, the systems are also very good applicable in prototyping and laboratory, as well as process qualification. The assemblies to be processed are transferred through the system on an universal work piece carrier. Thereby, those systems can be deployed very flexibly, especially with high product diversity and smaller unit quantities. Equipped with the optional vacuum module, void rates below far below 1% can be achieved.
The ASSCON VP810 represents
- Cost effective vapor phase soldering system
- Excellent soldering quality
- Simple and efficient soldering of assemblies with different thermal requirements
- Reliable soldering, also with particularly heavy, high mass assemblies and 3D assemblies
- Automatic control and monitoring of each soldering via Sensor Based Profiling New: With the VP810, Sensor Based Profiling is now also active in vacuum mode and thus enables the precise profiling of assemblies.
- Minimum space requirement because of compact design, which allows operation in each electronic manufacturing with a footprint of approx. 1 m² and a maximum soldering area of 610 x 460 mm (as vacuum version 480 x 295 mm).
- Very good energy efficiency with an average energy consumption with less than 3 kWh in the running production.
- New feature: Advanced Management Interface (AMI for short) – External solder profile creation and processing flexibly via external PC (PC not included in scope of delivery)
Vapor phase reflow soldering
- Means electronic manufacturing without changeover- and setup time during product change
- Creates high availability for the production
- Enables 100% First Pass Yield
- Is the ideal production process for batch-size-1-production
- Provides significant reduction of production costs due to process-related low energy consumption
- Under vacuum void rates of <1 % are possible
Specifications
| Max. assembly size | 610 x 460mm |
| Max. solder height | 60mm |
| Max. assembly height | 100mm |
| Average power consumption (Full load) | 2,5 kW |
| Average power consumption (Standby) | 1,8W |
| Average cycle time | 8 - 12 min. |
The vapor phase soldering systems of the VP810-series are designed as compact Stand-alone-systems. They are particularly suitable for users, processing applications with frequently changing products in small-batch production. Due to the universal applicability, the systems are also very good applicable in prototyping and laboratory, as well as process qualification. The assemblies to be processed are transferred through the system on an universal work piece carrier. Thereby, those systems can be deployed very flexibly, especially with high product diversity and smaller unit quantities. Equipped with the optional vacuum module, void rates below far below 1% can be achieved.
The ASSCON VP810 represents
- Cost effective vapor phase soldering system
- Excellent soldering quality
- Simple and efficient soldering of assemblies with different thermal requirements
- Reliable soldering, also with particularly heavy, high mass assemblies and 3D assemblies
- Automatic control and monitoring of each soldering via Sensor Based Profiling New: With the VP810, Sensor Based Profiling is now also active in vacuum mode and thus enables the precise profiling of assemblies.
- Minimum space requirement because of compact design, which allows operation in each electronic manufacturing with a footprint of approx. 1 m² and a maximum soldering area of 610 x 460 mm (as vacuum version 480 x 295 mm).
- Very good energy efficiency with an average energy consumption with less than 3 kWh in the running production.
- New feature: Advanced Management Interface (AMI for short) – External solder profile creation and processing flexibly via external PC (PC not included in scope of delivery)
Vapor phase reflow soldering
- Means electronic manufacturing without changeover- and setup time during product change
- Creates high availability for the production
- Enables 100% First Pass Yield
- Is the ideal production process for batch-size-1-production
- Provides significant reduction of production costs due to process-related low energy consumption
- Under vacuum void rates of <1 % are possible
| Type | Vapor Phase Soldering – Batch |
|---|
