Scienscope - X-ray Inspection System Xspection 3000

SNC-XSPECTION3000

Machine for offline X-Ray Inspection

Scienscope - X-ray Inspection System Xspection 3000

SNC-XSPECTION3000

Machine for offline X-Ray Inspection

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    • Expertise indépendante
    • Les clients nous donnent un 9+
    • Offre étendue
    • Plus de 45 ans d'expérience

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      • Expertise indépendante
      • Les clients nous donnent un 9+
      • Offre étendue
      • Plus de 45 ans d'expérience

      Besoin d'assistance, d'installation et/ou de formation ?
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      Nick Janssen

      Product specialist

        Or leave your details and we will contact you as soon as possible.

        • Expertise indépendante
        • Les clients nous donnent un 9+
        • Offre étendue
        • Plus de 45 ans d'expérience
        • Expertise indépendante
        • Les clients nous donnent un 9+
        • Offre étendue
        • Plus de 45 ans d'expérience
        UGS : SNC-XSPECTION3000 Catégories : , ,

        Description

        The Xspection 3000 is a single-closed tube, single flat panel detector, and all-purpose high-resolution X-Ray machine intended to perform both circuit board defect detection and quality insurance for the SMT industry worldwide. The X-ray machine has two main variants: the conventional 100kV version and the top-of-the-line 130kV version.

        Highlights

        • The new Al technology incorporates an advanced self-learning algorithm that can distinguish between bad and good images. lt adapts to the data it receives and continually improves its ability to identify and categorize images accurately.
        • The enhanced TH barrel fill tool is designed to effectively identify and address voids that may occur during the through-hole filling process. By doing so, the improved tool aims to enhance the overall quality and reliability of the final product.
        • Two high-resolution color cameras (20 Megapixel each) improve the mapping accuracy and make possible barcode reading and optical inspection upgrades.

        Features

        • Fully integrated 100kV or 130kV microfocus sealed tube
        • Spot size down to 5 µm
        • Larger flat panel detector increases field of view
        • Added one more mapping camera for close-up image capture
        • Self-learning Al software makes programming easy
        • XV table has been upgraded to servo driven for a faster cycle
        • Optional 360-degree rotating stage is lighter and taster
        • Accurate VOID calculation by better background definition
        • Enhanced BGA tool reduces false alarms
        • lndustrial PC: Microsoft Windows 11

         

        Specifications

        Maximum X and Y650mm x 500mm
        Maximum tilt45° (Optional 70°)
        Inspection speedServo XY
        Maximum X-Ray power100kV 5µm
        X-Ray flat panel detector+/- 127 x 127 mm - 16bit
        Resolution1536px x 1536px
        Pixel size85µm
        360° rotating tableOptional
        Optical inspection camera2 x 20 Megapixels
        Automatic programingYes
        Fiducial recognitionYes
        Automatic void percentage calculationYes
        BGA measuringYes
        BarcodeOptional (Optical optional camera)
        Offline programmingOptional
        Repair stationOptional
        SPCYes
        Windows 11 readyYes
        Dimensions (LxWxH)1510 x 1510 x 1870 mm, with tower light (2220mm)
        Weight1550 kg
        ElectricAC 110-240V VAC 50/60Hz

        The Xspection 3000 is a single-closed tube, single flat panel detector, and all-purpose high-resolution X-Ray machine intended to perform both circuit board defect detection and quality insurance for the SMT industry worldwide. The X-ray machine has two main variants: the conventional 100kV version and the top-of-the-line 130kV version.

        Highlights

        • The new Al technology incorporates an advanced self-learning algorithm that can distinguish between bad and good images. lt adapts to the data it receives and continually improves its ability to identify and categorize images accurately.
        • The enhanced TH barrel fill tool is designed to effectively identify and address voids that may occur during the through-hole filling process. By doing so, the improved tool aims to enhance the overall quality and reliability of the final product.
        • Two high-resolution color cameras (20 Megapixel each) improve the mapping accuracy and make possible barcode reading and optical inspection upgrades.

        Features

        • Fully integrated 100kV or 130kV microfocus sealed tube
        • Spot size down to 5 µm
        • Larger flat panel detector increases field of view
        • Added one more mapping camera for close-up image capture
        • Self-learning Al software makes programming easy
        • XV table has been upgraded to servo driven for a faster cycle
        • Optional 360-degree rotating stage is lighter and taster
        • Accurate VOID calculation by better background definition
        • Enhanced BGA tool reduces false alarms
        • lndustrial PC: Microsoft Windows 11