Asscon – VP2000

Vapor-phase soudure system for the high volume inline production

Asscon – VP2000

Vapor-phase soudure system for the high volume inline production

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    • Expertise indépendante
    • Les clients nous donnent un 9+
    • Offre étendue
    • Plus de 45 ans d'expérience

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      • Expertise indépendante
      • Les clients nous donnent un 9+
      • Offre étendue
      • Plus de 45 ans d'expérience

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      Nick Janssen

      Product specialist

        Or leave your details and we will contact you as soon as possible.

        • Expertise indépendante
        • Les clients nous donnent un 9+
        • Offre étendue
        • Plus de 45 ans d'expérience
        • Expertise indépendante
        • Les clients nous donnent un 9+
        • Offre étendue
        • Plus de 45 ans d'expérience
        UGS : 46123 Catégories : ,
        Vapor-phase soudure system for the high volume inline production

        Description

        ASSCON vapor phase reflow soldering systems set standards in soldering technology. The
        VP 2000 inline series are based on advanced patented high-tech soldering
        methods, and offer outstanding soldering quality in large series production.

        VP 2000 inline
        The innovative inline soldering system for large series usersis
        based on the highly successful oxygen-free process
        used in all ASSCON soldering systems, in which oxygen
        is excluded from the pre-heating and soldering process.
        Components are produced in the highest standard of quality.
        Production is also supported by dynamic profiling – a
        process for automatically controlling the optimum soldering
        profile in series production.
        The system is designed for bare-board product processing
        on large series production lines. Electrically width-adjusted
        conveying systems and center support permit fast straightforward
        adjustment for flexible production. The system is
        modularly designed, and consists of loading station, soldering
        and cooling zones.

        Optimum temperature control
        The use of liquid or vapor for as a mean of energy transmission
        is far more effective than convection. The vapor
        condenses on the solder product, the condensate encapsulates
        it completely, and thus transmits the energy. The
        entire pre-heating and soldering process takes place in an
        oxygen-free environment. Product overheating, component
        damage or PCB delamination cannot occur. An optimum
        temperature is automatically guaranteed at all positions on
        the product thanks to infinite sensor-based temperature
        gradient controlling.

        Different models:
        Type 100: 750 x 520(mm)
        Type 210: 600 x 520(mm)
        Type 310: 620 x 620(mm)
        Type 410: 620 x 450(mm)

        Specifications

        Type
        Length (mm)
        Width (mm)
        Height (mm)
        Weight (kg)
        Power
        Compressed air
        Min. PCB length (mm)
        Min. PCB width (mm)
        Max. PCB length (mm)
        Max. PCB width (mm)
        Inline
        Baking function

        ASSCON vapor phase reflow soldering systems set standards in soldering technology. The
        VP 2000 inline series are based on advanced patented high-tech soldering
        methods, and offer outstanding soldering quality in large series production.

        VP 2000 inline
        The innovative inline soldering system for large series usersis
        based on the highly successful oxygen-free process
        used in all ASSCON soldering systems, in which oxygen
        is excluded from the pre-heating and soldering process.
        Components are produced in the highest standard of quality.
        Production is also supported by dynamic profiling – a
        process for automatically controlling the optimum soldering
        profile in series production.
        The system is designed for bare-board product processing
        on large series production lines. Electrically width-adjusted
        conveying systems and center support permit fast straightforward
        adjustment for flexible production. The system is
        modularly designed, and consists of loading station, soldering
        and cooling zones.

        Optimum temperature control
        The use of liquid or vapor for as a mean of energy transmission
        is far more effective than convection. The vapor
        condenses on the solder product, the condensate encapsulates
        it completely, and thus transmits the energy. The
        entire pre-heating and soldering process takes place in an
        oxygen-free environment. Product overheating, component
        damage or PCB delamination cannot occur. An optimum
        temperature is automatically guaranteed at all positions on
        the product thanks to infinite sensor-based temperature
        gradient controlling.

        Different models:
        Type 100: 750 x 520(mm)
        Type 210: 600 x 520(mm)
        Type 310: 620 x 620(mm)
        Type 410: 620 x 450(mm)

        Type
        Length (mm)
        Width (mm)
        Height (mm)
        Weight (kg)
        Power
        Compressed air
        Min. PCB length (mm)
        Min. PCB width (mm)
        Max. PCB length (mm)
        Max. PCB width (mm)
        Inline
        Baking function