détails du produit


Saki – BF-X3

3D Automated X-ray Inspection (AXI)

En savoir

Saki 3D AXI systems are based on Saki’s unique Planar Computed Tomography (PCT) technology that captures 3D images of slices of the board, package, or module and reconstructs them in real time in a high-speed production setting. The process completely separates the top and bottom-side images of the board, measures components and features, determines placement variance and warpage, identifies and classifies the defects, such as dry joints and voids, and generates the associated data.  Saki’s automated high-resolution 3D X-ray inspection and measurement systems enable high image quality defect detection. The BF-X3 system is the youngest in the AXI range and with its closed tupe ideal for printed circuit board assembly.

Length1820 mm
Height1880 mm
Weight5200 kg
Power400 V / 3 / N / PE - 50 Hz / 60 Hz
Compressed airYes
Min. PCB length50 mm
Min. PCB width120 mm
Max. PCB length460 mm
Max. PCB width510 mm
InlineYes
PCB Clearance Top40 mm
PCB Clearance Bottom40 mm
Resolution camera head13 to 30 µm

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