{"id":8001,"date":"2023-09-22T11:29:33","date_gmt":"2023-09-22T11:29:33","guid":{"rendered":"https:\/\/smans.com\/knowledgeportal\/how-to-avoid-tombstoning-during-pcb-assembly\/"},"modified":"2024-01-24T16:46:12","modified_gmt":"2024-01-24T16:46:12","slug":"comment-eviter-le-tombstoning-pendant-l_assemblage-des-pcb","status":"publish","type":"knowledgeportal","link":"https:\/\/smans.com\/fr\/knowledgebase\/comment-eviter-le-tombstoning-pendant-l_assemblage-des-pcb\/","title":{"rendered":"Comment \u00e9viter le \u00ab\u00a0tombstoning\u00a0\u00bb pendant l&rsquo;assemblage des PCB?"},"content":{"rendered":"<h2>Tombstoning<\/h2>\n<p>Une situation qui se produit pendant le processus de soudage par refusion, en particulier dans un syst\u00e8me de refusion en phase vapeur ou en phase gazeuse.<\/p>\n<p>Cela signifie que <strong>les composants passifs des puces<\/strong>, tels que les r\u00e9sistances et les condensateurs, <strong>se redressent<\/strong> pendant le soudage.<\/p>\n<h3>La cause du tombstoning<\/h3>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"alignleft wp-image-21062\" src=\"https:\/\/oldsmans.falkor.alcor.cloud\/wp-content\/uploads\/\/Tombstoning-1-360x174.png\" sizes=\"auto, (max-width: 343px) 100vw, 343px\" srcset=\"https:\/\/oldsmans.falkor.alcor.cloud\/wp-content\/uploads\/Tombstoning-1-360x174.png 360w, https:\/\/oldsmans.falkor.alcor.cloud\/wp-content\/uploads\/Tombstoning-1-685x331.png 685w, https:\/\/oldsmans.falkor.alcor.cloud\/wp-content\/uploads\/Tombstoning-1.png 870w\" alt=\"tombstoning PCB component op PCB bord\" width=\"343\" height=\"165\" \/><\/p>\n<p>La cause de ce probl\u00e8me est \u00e0 rechercher dans<strong> l&rsquo;\u00e9coulement accidentel de p\u00e2te<\/strong> \u00e0 braser sur les deux extr\u00e9mit\u00e9s de contact du composant. Lorsque l&rsquo;une des deux extr\u00e9mit\u00e9s passe en phase liquide devant l&rsquo;autre, la p\u00e2te \u00e0 braser liquide tire le composant vers le haut.<\/p>\n<p>La <strong>charge thermique in\u00e9gale<\/strong> des surfaces de connexion de ce composant sur le PCB est responsable de <strong>l&rsquo;\u00e9coulement in\u00e9gal<\/strong>.<\/p>\n<h3>M\u00e9thodes de pr\u00e9vention du tombstoning<\/h3>\n<p>Il existe un certain nombre de solutions pour lutter contre ce d\u00e9faut de soudage. L&rsquo;action la plus logique, mais aussi la plus radicale, consiste \u00e0 <strong>redessiner les couches de cuivre du circuit imprim\u00e9<\/strong> de mani\u00e8re \u00e0 \u00e9galiser la charge thermique sur les surfaces de soudage. Il s&rsquo;agit d&rsquo;une t\u00e2che fastidieuse qui n\u00e9cessite l&rsquo;acc\u00e8s aux fichiers de conception et des connaissances sp\u00e9cialis\u00e9es. Dans de nombreux cas, cela n&rsquo;est pas r\u00e9alisable pour un sous-traitant.<\/p>\n<p>Une autre option se situe au niveau de la conception du stencil. Celle-ci permet <strong>d&rsquo;ajuster la forme et la position de la p\u00e2te<\/strong> qui est press\u00e9e sur les surfaces de connexion du PCB. Cela n\u00e9cessite un nouveau stencil, des connaissances sp\u00e9cialis\u00e9es et souvent des essais.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" class=\" wp-image-21065 alignright\" src=\"https:\/\/oldsmans.falkor.alcor.cloud\/wp-content\/uploads\/\/Tombstoning-2-360x70.png\" sizes=\"auto, (max-width: 447px) 100vw, 447px\" srcset=\"https:\/\/oldsmans.falkor.alcor.cloud\/wp-content\/uploads\/Tombstoning-2-360x70.png 360w, https:\/\/oldsmans.falkor.alcor.cloud\/wp-content\/uploads\/Tombstoning-2-1024x201.png 1024w, https:\/\/oldsmans.falkor.alcor.cloud\/wp-content\/uploads\/Tombstoning-2-685x134.png 685w, https:\/\/oldsmans.falkor.alcor.cloud\/wp-content\/uploads\/Tombstoning-2.png 1338w\" alt=\"\" width=\"447\" height=\"87\" \/><\/p>\n<p>Une option qui a<strong> le moins d&rsquo;impact<\/strong> sur le processus de production et qui n&rsquo;exige pas de connaissances sp\u00e9cialis\u00e9es de la part de l&rsquo;utilisateur est d&rsquo;<strong>ajuster la p\u00e2te \u00e0 souder<\/strong> de mani\u00e8re \u00e0 ce qu&rsquo;elle ne coule pas soudainement \u00e0 un certain point, mais qu&rsquo;elle le fasse progressivement, rendant l&rsquo;\u00e9coulement r\u00e9gulier et simultan\u00e9.<\/p>\n<p>La p\u00e2te \u00e0 souder <strong>IF 9057 ATL d&rsquo;Interflux<\/strong> est une p\u00e2te SAC305 &#8211; T4 avec une fonction \u00ab\u00a0anti-tombstoning\u00a0\u00bb int\u00e9gr\u00e9e. Elle laisse des r\u00e9sidus clairs et minimes apr\u00e8s le soudage et est absolument sans halog\u00e8ne.<\/p>\n<h4>Plus d&rsquo;info?<\/h4>\n<p>Laissez vos coordonn\u00e9es via le <a href=\"https:\/\/oldsmans.falkor.alcor.cloud\/fr\/contact\/\" target=\"_blank\" rel=\"noopener\"><strong>formulaire de contact<\/strong><\/a> et nous vous contacterons d\u00e8s que possible !<\/p>\n<p><em>\u2013 \u00e9crit par Bart van de Lisdonk<\/em><\/p>\n","protected":false},"featured_media":3361,"template":"","class_list":["post-8001","knowledgeportal","type-knowledgeportal","status-publish","has-post-thumbnail","hentry"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.1.1 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Comment \u00e9viter le &quot;tombstoning&quot; pendant l&#039;assemblage des PCB? - Smans<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/smans.com\/fr\/knowledgeportal\/comment-eviter-le-tombstoning-pendant-l_assemblage-des-pcb\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Comment \u00e9viter le &quot;tombstoning&quot; pendant l&#039;assemblage des PCB? - Smans\" \/>\n<meta property=\"og:description\" content=\"Tombstoning Une situation qui se produit pendant le processus de soudage par refusion, en particulier dans un syst\u00e8me de refusion en phase vapeur ou en phase gazeuse. 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