Asscon – VP2000

Vapor-phase soldering system for the high volume inline production

Asscon – VP2000

Vapor-phase soldering system for the high volume inline production

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        • Onafhankelijke expertise
        • Klanten geven ons een 9+
        • Uitgebreid aanbod
        • Meer dan 45 jaar ervaring
        • Onafhankelijke expertise
        • Klanten geven ons een 9+
        • Uitgebreid aanbod
        • Meer dan 45 jaar ervaring
        Artikelnummer: 46123 Categorieën: ,
        Vapor-phase soldering system for the high volume inline production

        Beschrijving

        ASSCON vapor phase reflow soldering systems set standards in soldering technology. The
        VP 2000 inline series are based on advanced patented high-tech soldering
        methods, and offer outstanding soldering quality in large series production.

        VP 2000 inline
        The innovative inline soldering system for large series usersis
        based on the highly successful oxygen-free process
        used in all ASSCON soldering systems, in which oxygen
        is excluded from the pre-heating and soldering process.
        Components are produced in the highest standard of quality.
        Production is also supported by dynamic profiling – a
        process for automatically controlling the optimum soldering
        profile in series production.
        The system is designed for bare-board product processing
        on large series production lines. Electrically width-adjusted
        conveying systems and center support permit fast straightforward
        adjustment for flexible production. The system is
        modularly designed, and consists of loading station, soldering
        and cooling zones.

        Optimum temperature control
        The use of liquid or vapor for as a mean of energy transmission
        is far more effective than convection. The vapor
        condenses on the solder product, the condensate encapsulates
        it completely, and thus transmits the energy. The
        entire pre-heating and soldering process takes place in an
        oxygen-free environment. Product overheating, component
        damage or PCB delamination cannot occur. An optimum
        temperature is automatically guaranteed at all positions on
        the product thanks to infinite sensor-based temperature
        gradient controlling.

        Different models:
        Type 100: 750 x 520(mm)
        Type 210: 600 x 520(mm)
        Type 310: 620 x 620(mm)
        Type 410: 620 x 450(mm)

        Specifications

        Type

        Vapor Phase reflow soldering

        Length (mm)

        5950

        Width (mm)

        1485

        Height (mm)

        1435

        Weight (kg)

        1650

        Power

        400 V / 3 / N / PE – 50 Hz / 60 Hz

        Compressed air

        yes

        Min. PCB length (mm)

        50

        Min. PCB width (mm)

        50

        Max. PCB length (mm)

        750

        Max. PCB width (mm)

        620

        Inline

        Yes

        Baking function

        No

        ASSCON vapor phase reflow soldering systems set standards in soldering technology. The
        VP 2000 inline series are based on advanced patented high-tech soldering
        methods, and offer outstanding soldering quality in large series production.

        VP 2000 inline
        The innovative inline soldering system for large series usersis
        based on the highly successful oxygen-free process
        used in all ASSCON soldering systems, in which oxygen
        is excluded from the pre-heating and soldering process.
        Components are produced in the highest standard of quality.
        Production is also supported by dynamic profiling – a
        process for automatically controlling the optimum soldering
        profile in series production.
        The system is designed for bare-board product processing
        on large series production lines. Electrically width-adjusted
        conveying systems and center support permit fast straightforward
        adjustment for flexible production. The system is
        modularly designed, and consists of loading station, soldering
        and cooling zones.

        Optimum temperature control
        The use of liquid or vapor for as a mean of energy transmission
        is far more effective than convection. The vapor
        condenses on the solder product, the condensate encapsulates
        it completely, and thus transmits the energy. The
        entire pre-heating and soldering process takes place in an
        oxygen-free environment. Product overheating, component
        damage or PCB delamination cannot occur. An optimum
        temperature is automatically guaranteed at all positions on
        the product thanks to infinite sensor-based temperature
        gradient controlling.

        Different models:
        Type 100: 750 x 520(mm)
        Type 210: 600 x 520(mm)
        Type 310: 620 x 620(mm)
        Type 410: 620 x 450(mm)

        Type

        Vapor Phase reflow soldering

        Length (mm)

        5950

        Width (mm)

        1485

        Height (mm)

        1435

        Weight (kg)

        1650

        Power

        400 V / 3 / N / PE – 50 Hz / 60 Hz

        Compressed air

        yes

        Min. PCB length (mm)

        50

        Min. PCB width (mm)

        50

        Max. PCB length (mm)

        750

        Max. PCB width (mm)

        620

        Inline

        Yes

        Baking function

        No