Product details

Asscon – VP7000 vacuum

Vapor-phase vacuum soldering system for the high volume inline production.

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Vapor Phase Vacuum Soldering Systems
High-Performance Inline Systems for Large Series

ASSCON vapor phase reflow soldering systems set standards in soldering technology. The
VP 7000 vacuum inline systems are based on advanced patented high-tech soldering
methods and offer outstanding soldering quality in large series production.

Multi vacuum for best results
The innovative inline soldering system for large series users
is equipped with the patented Multi Vacuum technology. In
the Multi Vacuum soldering process products are placed
under a vacuum both before and during melting of the
solder paste. Thanks to the benefits of modern ASSCON
vapor phase soldering technology with vacuum handling,
hitherto unrivalled levels are achieved in soldering quality.
Void-free soldering is particularly important in the case of
large-area, energy transmitting solder joints. The excellent
soldering result is also supported by Dynamic Profiling – a
process for automatically controlling the optimum soldering
profile in series production.

Inline production for high volume
The system is designed for carrier-free product processing
integration into large series production lines. Electrically
width-adjusted conveying systems and center support permit
fast straight-forward adjustment for flexible production.
The system is modularly designed, and consists of loading
station, soldering zone, vacuum chamber and cooling zone.
Aside from the low energy consumption rates ensured by
the process, the system also impresses with fail-safe operation.
Multi Vacuum soldering is the answer to the challenges
of the future. ASSCON is the leader in the field of
vapor phase soldering technology and
develops innovative processes.

Different models:
Type 200: 520 x 450(mm)
Type 400: 620 x 430(mm)

Length4870 mm
Width1360 mm
Height1435 mm
Weight1850 kg
Power400 V / 3 / N / PE - 50 Hz / 60 Hz
Compressed airYes
Min. PCB length50 mm
Min. PCB width50 mm
Max. PCB length620 mm
Max. PCB width450 mm
Baking functionYes

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