The beginning of professional assembly unit repair:
HR 100 – flexible hybrid rework!
Gentle desoldering and soldering without component shifting!
Patented hybrid rework technology (combination of IR heating technology and convection) for safe desoldering and soldering
Optimum energy transfer and gentle heating of chip components 0201 up to 20 x 20 mm SMDs
Exchangeable hybrid adaptors of various sizes direct up to 200 W of heating energy specifically to the component
No blowing away of neighbouring components
Optionally available with stand, 800 W IR bottom heating and PCB intake
Vac Pen for safe handling of devices
Operation software IRSoft
|Power||240 VAC / 50 Hz / 60 Hz|
|product_maxpcbsize||290 x 250|
|Max, Power||1000 W|