Product details
Saki – BF-3Si-MD2
3D M size dual lane inspection of solderpaste in superb efficiency and accuracy
Lees meerSolder paste is applied during the printing process and is necessary to attach the components to a circuit board to assure the proper electrical connection. The printing process has become extremely complex due to today’s circuit board configurations that pack very small components into extremely tight spaces. Over 50% of circuit board defects are rooted in problems related to solder paste printing. To accurately determine the accuracy of the printing process, 3D solder paste inspection has become a requirement.
| Length | 1430 mm |
|---|---|
| Height | 1500 mm |
| Weight | 850 kg |
| Power | 240 V / 1 / N / PE - 50 Hz / 60 Hz |
| Compressed air | Yes |
| Min. PCB length | 50 mm |
| Min. PCB width | 60 mm |
| Max. PCB length | 320 mm |
| Max. PCB width | 330 mm |
| Inline | Yes |
| PCB Clearance Top | 40 mm |
| PCB Clearance Bottom | 50 mm |
| Resolution camera head | 7 | 12 | 18 µm |
100% functional testing wasn’t an option, Saki 3D AOI makes PCBA functional testing practically unnecessary
Since the beginning of 2018 BEA SA produces their own circuit boards, after outsourcing this to China for fifteen years. This was only possible of personnel costs were kept as low as possible. 100% functional testing of the electronics wasn’t possible to close the business case. Smans’ s advice to invest in Saki 3D AOI was an excellent choice. In the first period of production all circuit boards have been functionally tested…
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