Saki – BF-X2 200 kV

Saki 3D AXI systems are based on Saki’s unique Planar Computed Tomography (PCT) technology that captures 3D images of slices of the board, package, or module and reconstructs them in real time in a high-speed production setting. The process completely separates the top and bottom-side images of the board, measures components and features, determines placement variance and warpage, identifies and classifies the defects, such as dry joints and voids, and generates the associated data. Saki’s automated high-resolution 3D X-ray inspection and measurement systems enable high image quality defect detection. The BF-X2 200kV system is dedicated for semiconductor and insulated gate bipolar transistor (IGBT) power module inspection.