Description

Saki’s new L size machine supports PCB sizes up to 500 W x 510 L mm. The system is offered in three resolutions 7, 12 and 18 μm.
Many design characteristics are shared between our L size AOI and SPI systems including the frame, gantry, PC, GUI and others. This commonality minimizes spare parts inventory and requires less training.

Hardware that provides high-speed and high-accuracy inspection
– Rigid gantry structure and exclusive dual motor drive system
– High resolution linear scale provides high accuracy positioning
– CoaXPress camera delivers faster inspection and measurement processes
– Automatic Self-diagnostic functionality monitors machine performance

Hardware : Flexible Configurations meet a broad range of applications
– Multiple inspection resolutions of 7μm, 12μm, and 18μm
– Multiple machines sizes include medium, large and extra large, and dual lane
– Side Cameras
– NEW –> Saki’s innovative Z-axis optical-head control feature is now available
with 3Di Series inline AOI systems
– Select from a variety of options including machine size, inspection resolution, hardware and software features
to meet your specific requirements

Advanced Software Features
– Saki Self-Programming Software (SSP)
– Inspection compliance with IPC 610 Standards
– Extra Component Detection identifies foreign material
– “Fujiyama”Through-hole Device Solder Inspection
– NEW –> Job Data Convert Function automatically converts Pick-and-Place machine data to inspection machine data. This function greatly reduces the time required to create inspection data. (*) (**)
(*) Get in touch to ask about details of the machines on which it is available.
(**) Optional function.

Specifications