Description

Saki’s new L size machine supports PCB sizes up to 500 W x 510 L mm. The system is offered in three resolutions 7, 12 and 18 μm. Many design characteristics are shared between our L size AOI and SPI systems including the frame, gantry, PC, GUI and others. This commonality minimizes spare parts inventory and requires less training. Hardware that provides high-speed and high-accuracy inspection

• Rigid gantry structure and exclusive dual motor drive system
• High resolution linear scale provides high accuracy positioning
• CoaXPress camera delivers faster inspection and measurement processes
• Automatic Self-diagnostic functionality monitors machine performance
• Hardware : Flexible Configurations meet a broad range of applications
• Multiple inspection resolutions of 7μm, 12μm, and 18μm
• Multiple machines sizes include medium, large and extra large, and dual lane
• Side Cameras – NEW –> Saki’s innovative Z-axis optical-head control feature is now available with 3Di Series inline AOI systems
• Select from a variety of options including machine size, inspection resolution, hardware and software features to meet your specific requirements Advanced Software Features
• Saki Self-Programming Software (SSP)
• Inspection compliance with IPC 610 Standards
• Extra Component Detection identifies foreign material
• “Fujiyama”Through-hole Device Solder Inspection – NEW –> Job Data Convert Function automatically converts Pick-and-Place machine data to inspection machine data. This function greatly reduces the time required to create inspection data. (*) (**)

(*) Get in touch to ask about details of the machines on which it is available.(**) Optional function.