Saki - 3D Solder paste inspection L 3Si-LS2 / LD2
IP-11b62261
Large size PCB’s
Single Lane / Dual Lane
Saki - 3D Solder paste inspection L 3Si-LS2 / LD2
IP-11b62261
Large size PCB’s
Single Lane / Dual Lane
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Description
Saki’s Large machine supports PCB sizes up to 500 W x 510 L mm , 19.68″ W x 20.07″ L in. The system is offered with your choice of three resolutions 7, 12 and 18 micron. Many design characteristcis are shared between our L size AOI and SPI systems including the frame, gantry, PC, GUI and others. This commonality minimizes spare parts inventory and requires less training. Hardware providing high-speed and high-accurate inspection – Shares the same rigid gantry structure with Saki’s 3Di-AOI – Rigid gantry structure and exclusive dual Y axis motor drive system – High resolution linear scale for accurate positioning – CoaXPress camera delivers higher speed and higher accuracy measurement Automatic Self-diagnostic functionality monitors machine performance Hardware : Flexible Configurations for Wide Ranging Applications – Simultaneous 2D and 3D inspection of the entire PCB surface – Three sensors are available with 7μm, 12μm, and 18μm resolution – Three machine sizes available including dual lane to support varying applications Select from a variety of options including machine size, inspection resolution, hardware and software features to meet your specific requirements Advanced Software Features – Warpage management – Coplanarity inspection SPC Function
Specifications
Size (W) x (D) x (H) [Main body]mm | 1040 x 1440 x 1500 |
Weight Approx. | 900 Kg |
Electric Power Requirement | Single-phase ~ 200-240V +/-10%, 50/60Hz |
Resolution | 7μm, 12μm, 18μm |
Air Requirement | 0.5MPa, 5L/min (ANR) |
PCB Size | 7µm camera head: 50 W x 60 L - 330 W x 330 L |
PCB Size | 12/18 µm camera head: 50 W x 60 L - 500 W x 510 L |
PCB Clearance Top | 40mm, Bottom: 60mm |
Saki’s Large machine supports PCB sizes up to 500 W x 510 L mm , 19.68″ W x 20.07″ L in. The system is offered with your choice of three resolutions 7, 12 and 18 micron. Many design characteristcis are shared between our L size AOI and SPI systems including the frame, gantry, PC, GUI and others. This commonality minimizes spare parts inventory and requires less training. Hardware providing high-speed and high-accurate inspection – Shares the same rigid gantry structure with Saki’s 3Di-AOI – Rigid gantry structure and exclusive dual Y axis motor drive system – High resolution linear scale for accurate positioning – CoaXPress camera delivers higher speed and higher accuracy measurement Automatic Self-diagnostic functionality monitors machine performance Hardware : Flexible Configurations for Wide Ranging Applications – Simultaneous 2D and 3D inspection of the entire PCB surface – Three sensors are available with 7μm, 12μm, and 18μm resolution – Three machine sizes available including dual lane to support varying applications Select from a variety of options including machine size, inspection resolution, hardware and software features to meet your specific requirements Advanced Software Features – Warpage management – Coplanarity inspection SPC Function