Saki - 3D Solder paste inspection XL 3Si-ZS2
SAKI-M3
Extra Large PCB’s
Single Lane
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Description
Saki’s Extra Large machine supports PCB sizes up to 686 W x 870 L mm, 27″ W x 34.25″ L in. The system is offered with your choice of two resolutions, 12 and 18 micron. Many design characteristcis are shared between our XL size AOI and SPI systems including the frame, gantry, PC, GUI and others. This commonality minimizes spare parts inventory and requires less training. Hardware providing high-speed and high-accurate inspection – Shares the same rigid gantry structure with Saki’s 3Di-AOI – Rigid gantry structure and exclusive dual Y axis motor drive system – High resolution linear scale for accurate positioning – CoaXPress camera delivers higher speed and higher accuracy measurement Automatic Self-diagnostic functionality monitors machine performance Hardware : Flexible Configurations for Wide Ranging Applications – Simultaneous 2D and 3D inspection of the entire PCB surface – Three sensors are available with 7μm, 12μm, and 18μm resolution *3Si-ZS2 supports the optical unit with resolution of 18µm. – Three machine sizes available including dual lane to support varying applications *3Si-ZS2 supports a single lane only. Select from a variety of options including machine size, inspection resolution, hardware and software features to meet your specific requirements Advanced Software Features – Warpage management – Coplanarity inspection – SPC Function
Specifications
Size (W) x (D) x (H) [Main body]mm | 1340 x 1440 x 1500 |
Weight Approx. | 900 Kg |
Electric Power Requirement | Single-phase ~ 200-240V +/-10%, 50/60Hz |
Resolution | 18μm |
Air Requirement | 0.5MPa, 5L/min (ANR) |
PCB Clearance Top | 40mm, Bottom: 60mm |
Saki’s Extra Large machine supports PCB sizes up to 686 W x 870 L mm, 27″ W x 34.25″ L in. The system is offered with your choice of two resolutions, 12 and 18 micron. Many design characteristcis are shared between our XL size AOI and SPI systems including the frame, gantry, PC, GUI and others. This commonality minimizes spare parts inventory and requires less training. Hardware providing high-speed and high-accurate inspection – Shares the same rigid gantry structure with Saki’s 3Di-AOI – Rigid gantry structure and exclusive dual Y axis motor drive system – High resolution linear scale for accurate positioning – CoaXPress camera delivers higher speed and higher accuracy measurement Automatic Self-diagnostic functionality monitors machine performance Hardware : Flexible Configurations for Wide Ranging Applications – Simultaneous 2D and 3D inspection of the entire PCB surface – Three sensors are available with 7μm, 12μm, and 18μm resolution *3Si-ZS2 supports the optical unit with resolution of 18µm. – Three machine sizes available including dual lane to support varying applications *3Si-ZS2 supports a single lane only. Select from a variety of options including machine size, inspection resolution, hardware and software features to meet your specific requirements Advanced Software Features – Warpage management – Coplanarity inspection – SPC Function