Asscon – VP510

Asscon – VP510

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    • Independent expertise
    • Customers give us a 9+
    • Extensive offer
    • More than 45 years of experience

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    Worry-free investing through business leasing

    Do you want to expand or replace your machine park? This is possible via Smans. Consider a manual, semi-automatic machine or a fully automated production line. We work together with reliable leasing partners. They offer flexible and reliable tailor-made business financing solutions. 

    We always first identify the value of your project and your objectives.

    Thanks to our expertise, we offer our leasing partners a lot of clarity. They can therefore make a better risk assessment than standard providers

    The benefits of leasing through Smans:

    • financial space/maintenance of liquid assets;
    • for both large and small investments;
    • promote your growth and increase your capacity;
    • strengthen your competitive position through an up-to-date machine park.

    Do you want to know what business leasing can do for your company? Contact team Smans.

      Would you like to know what business leasing could mean for your project? Our sales team will be happy to answer all your questions!


      • Independent expertise
      • Customers give us a 9+
      • Extensive offer
      • More than 45 years of experience

      Contact us

      In need direct contact with a sales representative?

      Nick Janssen

      Product specialist

        Or leave your details and we will contact you as soon as possible.

        • Independent expertise
        • Customers give us a 9+
        • Extensive offer
        • More than 45 years of experience
        • Independent expertise
        • Customers give us a 9+
        • Extensive offer
        • More than 45 years of experience
        SKU: 46118 Categories: ,

        Description

        ASSCON Vapor-Phase-Reflow-Soldering Systems set the
        benchmark in soldering technology. The physical laws of
        the process permit defect-free soldering of the most complicated
        SMT assemblies in any required geometry even
        when using lead-free solder pastes. Components such as
        QFPs, BGAs, Flip-Chips as well as hybrids are processed
        with very high quality results.

        The VP 510 Series is designed to be used in the laboratory
        and for prototype production. Due to its compact design
        and optionally an integrated cooling unit the machine may
        be used at any place and without preparatory set-up even
        at different workplaces. With an integrated closed cooling
        system installed only a 240 V / 120 V supply connection is
        required to operate the unit.

        Machine design concept
        The machine is impressive due its simplicity, ease of use
        and providing the ability to solder high quality assemblies
        defect-free. Integrated in the self-supporting structure is
        the process zone with electrically operated lift-unit and the
        work piece carrier. The electronic control includes temperature
        sensors for the heaters, fluid and steam temperatures
        and therefore ensures absolute process reliability. An automatic
        measuring cycle recognizes the prozess fluid used.
        The machine is delivered with an automatic monitoring of
        the process fluid level by default. The whole process can
        be observed through a sight window. A quick start function
        reduces energy consumption during stand by mode and
        guarantees operational readiness for the next solder cycle
        within the shortest time.

        Process sequence
        After opening the machine cover the solder product is
        placed on a work piece carrier. The process starts. An electric
        motor moves the work piece carrier with the assemblies
        to be soldered into soldering position. The PLC controls vapor
        production according to the set temperature gradients.
        Having reached the soldering temperature the work piece
        carrier is moved to the cooling position. The inner lock between
        process and cooling zone closes. The solder product
        is cooled by an effective blower system. After the cooling
        time has expired, a signal indicates release for removing of
        the work piece. An electromechanical guard locking prevents
        from opening the machine during production process.

        Specifications

        Type
        Length (mm)
        Width (mm)
        Height (mm)
        Weight (kg)
        Power
        Compressed air
        Min. PCB length (mm)
        Min. PCB width (mm)
        Max. PCB length (mm)
        Max. PCB width (mm)
        Inline
        Baking function

        ASSCON Vapor-Phase-Reflow-Soldering Systems set the
        benchmark in soldering technology. The physical laws of
        the process permit defect-free soldering of the most complicated
        SMT assemblies in any required geometry even
        when using lead-free solder pastes. Components such as
        QFPs, BGAs, Flip-Chips as well as hybrids are processed
        with very high quality results.

        The VP 510 Series is designed to be used in the laboratory
        and for prototype production. Due to its compact design
        and optionally an integrated cooling unit the machine may
        be used at any place and without preparatory set-up even
        at different workplaces. With an integrated closed cooling
        system installed only a 240 V / 120 V supply connection is
        required to operate the unit.

        Machine design concept
        The machine is impressive due its simplicity, ease of use
        and providing the ability to solder high quality assemblies
        defect-free. Integrated in the self-supporting structure is
        the process zone with electrically operated lift-unit and the
        work piece carrier. The electronic control includes temperature
        sensors for the heaters, fluid and steam temperatures
        and therefore ensures absolute process reliability. An automatic
        measuring cycle recognizes the prozess fluid used.
        The machine is delivered with an automatic monitoring of
        the process fluid level by default. The whole process can
        be observed through a sight window. A quick start function
        reduces energy consumption during stand by mode and
        guarantees operational readiness for the next solder cycle
        within the shortest time.

        Process sequence
        After opening the machine cover the solder product is
        placed on a work piece carrier. The process starts. An electric
        motor moves the work piece carrier with the assemblies
        to be soldered into soldering position. The PLC controls vapor
        production according to the set temperature gradients.
        Having reached the soldering temperature the work piece
        carrier is moved to the cooling position. The inner lock between
        process and cooling zone closes. The solder product
        is cooled by an effective blower system. After the cooling
        time has expired, a signal indicates release for removing of
        the work piece. An electromechanical guard locking prevents
        from opening the machine during production process.

        Type
        Length (mm)
        Width (mm)
        Height (mm)
        Weight (kg)
        Power
        Compressed air
        Min. PCB length (mm)
        Min. PCB width (mm)
        Max. PCB length (mm)
        Max. PCB width (mm)
        Inline
        Baking function