Ersa - Rework Station HR 600/3P
ERS-0HR6003PVER3
Automatic rework – intuitive use
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Description
The Ersa Rework System HR 600/3P enables automatic repair of SMT components such as BGA and MLF up to edge lengths of 1 x 1 mm with precision and reliability. HRSoft 2´s graphical user interface enables effortless process selection and operation for any user.
From 01005 chips to large SMT connectors (120 mm), from SMT flip chips to THT pin grid arrays, BGAs on flex circuit or multilayer BGAs – Ersa rework systems offer the optimal solution for all applications.
- High-precision axis system (X, Y, Z) and high-resolution cameras
- Automated component placement as well as soldering and desoldering processes
- Hybrid heating head with two heating zones
- Large-area, powerful IR underheating in three zones
- Non-contact temperature measurement with digital sensor
- Three K-type thermocouple inputs for Accu-TC sensor
- Effective assembly cooling with compressed air
Specifications
Dimensions (WxDxH) | 850 x 660 x 573 mm |
Weight | 65 kg |
Anstistatic Design | yes |
Power Rating | 3.200 W |
Nominal Voltage | 220 V - 240 VAC, 50-60 Hz, 16 A |
Top heating | hybrid radiator 800 W, in two zones, 60 x 60 mm |
Bottom heating | IR heater (3x 800 W), 380 x 250 mm |
Measuring channels | 3x K-type, 1x IRS |
Position laser | Class II |
PCB size | up to 390 x 300 mm (+x), up to 535 x 300 mm (+x), (0HR600/3PL) |
PCB size | 1 x 1 mm up to 60 x 60 mm |
Axis accuracy | up to +/- 25 µm |
Top placement camera | 5 MP GigE color camera |
Component camera bottom | 5 MP GigE black and white camera |
Working distance (typical) | 30-60 mm to top heater, 35 mm to bottom heater |
Compressed air connection | 6-10 bar (oil-free). ¼ inch quick coupling |
Air volume cooling | approx. 105 l/min (@ 6 bar) |
Test symbol | CE |
Operating software | HRSoft 2 - suitable for Windows 8 and Windows 10 |
Reflow process camera | 10.7 MP, CMOS GigE color camera, 50 mm focal length, 2x LED illumination, adjustable |
The Ersa Rework System HR 600/3P enables automatic repair of SMT components such as BGA and MLF up to edge lengths of 1 x 1 mm with precision and reliability. HRSoft 2´s graphical user interface enables effortless process selection and operation for any user.
From 01005 chips to large SMT connectors (120 mm), from SMT flip chips to THT pin grid arrays, BGAs on flex circuit or multilayer BGAs – Ersa rework systems offer the optimal solution for all applications.
- High-precision axis system (X, Y, Z) and high-resolution cameras
- Automated component placement as well as soldering and desoldering processes
- Hybrid heating head with two heating zones
- Large-area, powerful IR underheating in three zones
- Non-contact temperature measurement with digital sensor
- Three K-type thermocouple inputs for Accu-TC sensor
- Effective assembly cooling with compressed air