Saki – BF-X2 200 kV

Saki – BF-X2 200 kV

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    • Independent expertise
    • Customers give us a 9+
    • Extensive offer
    • More than 45 years of experience

    More information about leasing options

    Worry-free investing through business leasing

    Do you want to expand or replace your machine park? This is possible via Smans. Consider a manual, semi-automatic machine or a fully automated production line. We work together with reliable leasing partners. They offer flexible and reliable tailor-made business financing solutions. 

    We always first identify the value of your project and your objectives.

    Thanks to our expertise, we offer our leasing partners a lot of clarity. They can therefore make a better risk assessment than standard providers

    The benefits of leasing through Smans:

    • financial space/maintenance of liquid assets;
    • for both large and small investments;
    • promote your growth and increase your capacity;
    • strengthen your competitive position through an up-to-date machine park.

    Do you want to know what business leasing can do for your company? Contact team Smans.

      Would you like to know what business leasing could mean for your project? Our sales team will be happy to answer all your questions!


      • Independent expertise
      • Customers give us a 9+
      • Extensive offer
      • More than 45 years of experience

      Contact us

      In need direct contact with a sales representative?

      Nick Janssen

      Product specialist

        Or leave your details and we will contact you as soon as possible.

        • Independent expertise
        • Customers give us a 9+
        • Extensive offer
        • More than 45 years of experience
        • Independent expertise
        • Customers give us a 9+
        • Extensive offer
        • More than 45 years of experience
        SKU: 46289 Categories: ,

        Description

        Saki 3D AXI systems are based on Saki’s unique Planar Computed Tomography (PCT) technology that captures 3D images of slices of the board, package, or module and reconstructs them in real time in a high-speed production setting. The process completely separates the top and bottom-side images of the board, measures components and features, determines placement variance and warpage, identifies and classifies the defects, such as dry joints and voids, and generates the associated data. Saki’s automated high-resolution 3D X-ray inspection and measurement systems enable high image quality defect detection. The BF-X2 200kV system is dedicated for semiconductor and insulated gate bipolar transistor (IGBT) power module inspection.

        Specifications

        Type
        Length (mm)
        Height (mm)
        Weight (kg)
        Power
        Compressed air
        Min. PCB length (mm)
        Min. PCB width (mm)
        Max. PCB length (mm)
        Max. PCB width (mm)
        Inline
        PCB Clearance Top (mm)
        PCB Clearance Bottom (mm)
        Resolution camera head (µm)

        Saki 3D AXI systems are based on Saki’s unique Planar Computed Tomography (PCT) technology that captures 3D images of slices of the board, package, or module and reconstructs them in real time in a high-speed production setting. The process completely separates the top and bottom-side images of the board, measures components and features, determines placement variance and warpage, identifies and classifies the defects, such as dry joints and voids, and generates the associated data. Saki’s automated high-resolution 3D X-ray inspection and measurement systems enable high image quality defect detection. The BF-X2 200kV system is dedicated for semiconductor and insulated gate bipolar transistor (IGBT) power module inspection.

        Type
        Length (mm)
        Height (mm)
        Weight (kg)
        Power
        Compressed air
        Min. PCB length (mm)
        Min. PCB width (mm)
        Max. PCB length (mm)
        Max. PCB width (mm)
        Inline
        PCB Clearance Top (mm)
        PCB Clearance Bottom (mm)
        Resolution camera head (µm)