Saki – BF-3Si-MD2

3D M size dual lane inspection of solderpaste in superb efficiency and accuracy

Solder paste is applied during the printing process and is necessary to attach the components to a circuit board to assure the proper electrical connection. The printing process has become extremely complex due to today’s circuit board configurations that pack very small components into extremely tight spaces. Over 50% of circuit board defects are rooted in problems related to solder paste printing. To accurately determine the accuracy of the printing process, 3D solder paste inspection has become a requirement.

Length	1430 mm
Height	1500 mm
Weight	850 kg
Power	240 V / 1 / N / PE - 50 Hz / 60 Hz
Compressed air	Yes
Min. PCB length	50 mm
Min. PCB width	60 mm
Max. PCB length	320 mm
Max. PCB width	330 mm
Inline	Yes
PCB Clearance Top	40 mm
PCB Clearance Bottom	50 mm
Resolution camera head	7 \| 12 \| 18 µm