Full inline integration and no need for workpiece carriers, this is the focus of ASSCON´s vapor phase inline soldering systems. The simple transfer and takeover of PCBs via pin chains characterize this type of inline system. Electrically width-adjustable transport systems allow fast and uncomplicated adaptation to changing products and thus offer the flexibility required in today’s modern electronics production. The integration into inline control computers is also possible. Full automation combined with the highest quality in the process is the guiding principle here.
With the patented Multi Vacuum technology, voids in solder joints are reduced and void rates <1% are achievable. The vacuum module, which can be switched on during the process, is located outside the soldering area (Clean Vacuum Technology) and is therefore extremely low in maintenance.
|Power||400 V / 3 / N / PE - 50 Hz / 60 Hz|
|Max. PCB length||370 mm|