Saki - 3D Automated optical inspection L Dual Lane 3Di-LD3
SAKI-M12
Saki’s 3Di Series applies cutting edge technologies to improve production efficiency and enhance production quality across the entire assembly line.
Saki - 3D Automated optical inspection L Dual Lane 3Di-LD3
SAKI-M12
Saki’s 3Di Series applies cutting edge technologies to improve production efficiency and enhance production quality across the entire assembly line.
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Description
Hardware that provides high-speed and high-accuracy inspection – Rigid gantry structure and exclusive dual motor drive system – High resolution linear scale provides high accuracy positioning – CoaXPress camera delivers faster inspection and measurement processes Hardware : Flexible Configurations meet a broad range of applications – Multiple inspection resolutions of 7μm, 12μm, and 18μm- – Multiple machine sizes include medium, large, extra large and dual lane – Side Cameras – Saki’s innovative Z-axis optical-head control feature is now available with 3Di Series inline AOI systems Advanced Software Features – Saki Self-Programming Software (SSP) – Inspection compliance with IPC 610 Standards – Extra Component Detection identifies foreign material – “Fujiyama”Through-hole Device Solder Inspection NEW Job Data Convert Function automatically converts Pick-and-Place machine data to inspection machine data. This function greatly reduces the time required to create inspection data.
Specifications
Size (WxDxH) | 1040 x 1440 x 1500 mm |
Weight approx. | 900 Kg |
Electric power requirement | Single-phase ~ 200-240V +/-10%, 50/60Hz |
Resolution | 8μm |
Air requirement | 0.5MPa, 5 l/min (ANR) |
PCB Size in mm | Single Mode 50 W x 60 L / 500 W x 510 L - Dual Mode 50 W x 60 L / 320 W x 510 L |
PCB clearance | Top 40mm, Bottom 50mm |
Hardware that provides high-speed and high-accuracy inspection – Rigid gantry structure and exclusive dual motor drive system – High resolution linear scale provides high accuracy positioning – CoaXPress camera delivers faster inspection and measurement processes Hardware : Flexible Configurations meet a broad range of applications – Multiple inspection resolutions of 7μm, 12μm, and 18μm- – Multiple machine sizes include medium, large, extra large and dual lane – Side Cameras – Saki’s innovative Z-axis optical-head control feature is now available with 3Di Series inline AOI systems Advanced Software Features – Saki Self-Programming Software (SSP) – Inspection compliance with IPC 610 Standards – Extra Component Detection identifies foreign material – “Fujiyama”Through-hole Device Solder Inspection NEW Job Data Convert Function automatically converts Pick-and-Place machine data to inspection machine data. This function greatly reduces the time required to create inspection data.