Saki - 3D Solder Paste Inspection 3Si-LS2 / 3Si-LD2
SAKI-M1
Medium size PCB’s
Single Lane / Dual Lane
Saki - 3D Solder Paste Inspection 3Si-LS2 / 3Si-LD2
SAKI-M1
Medium size PCB’s
Single Lane / Dual Lane
Hulp, installatie en/of training nodig?
Bel +32 (0)14 42 44 01 of neem contact met ons op
Description
Compact machine for Medium size PCBs up to 330 W x 330 L mm, 12.99 W x 12.99 L in. The machine footprint is 25% smaller than our previous model improving productivity. Many design characteristcis are shared between our M size AOI and SPI systems including the frame, gantry, PC, GUI and others. This commonality minimizes spare parts inventory and requires less training.
Hardware providing high-speed and high-accurate inspection
- Shares the same rigid gantry structure with Saki’s 3Di-AOI
- Rigid gantry structure and exclusive dual Y axis motor drive system –
- High resolution linear scale for accurate positioning
- CoaXPress camera delivers higher speed and higher accuracy measurement
Automatic Self-diagnostic functionality monitors machine performance
Hardware : Flexible Configurations for Wide Ranging Applications
- Simultaneous 2D and 3D inspection of the entire PCB surface
- Three sensors are available with 7μm, 12μm, and 18μm resolution
- Three machine sizes available including dual lane to support varying applications
Select from a variety of options including machine size, inspection resolution, hardware and software features to meet your specific requirements
Advanced Software Features
- Warpage management
- Coplanarity inspection
- SPC Function
Specifications
Size (W) x (D) x (H) [Main body]mm | 850 x 1430 x 1500 |
Weight Approx. | 850 Kg |
Electric Power Requirement | Single-phase ~ 200-240V +/-10%, 50/60Hz |
Resolution | 7μm, 12μm, 18μm |
Air Requirement | 0.5MPa, 5L/min (ANR) |
PCB Clearance Top | 40mm, Bottom: 60mm |
Compact machine for Medium size PCBs up to 330 W x 330 L mm, 12.99 W x 12.99 L in. The machine footprint is 25% smaller than our previous model improving productivity. Many design characteristcis are shared between our M size AOI and SPI systems including the frame, gantry, PC, GUI and others. This commonality minimizes spare parts inventory and requires less training.
Hardware providing high-speed and high-accurate inspection
- Shares the same rigid gantry structure with Saki’s 3Di-AOI
- Rigid gantry structure and exclusive dual Y axis motor drive system –
- High resolution linear scale for accurate positioning
- CoaXPress camera delivers higher speed and higher accuracy measurement
Automatic Self-diagnostic functionality monitors machine performance
Hardware : Flexible Configurations for Wide Ranging Applications
- Simultaneous 2D and 3D inspection of the entire PCB surface
- Three sensors are available with 7μm, 12μm, and 18μm resolution
- Three machine sizes available including dual lane to support varying applications
Select from a variety of options including machine size, inspection resolution, hardware and software features to meet your specific requirements
Advanced Software Features
- Warpage management
- Coplanarity inspection
- SPC Function