Saki - 3D Solder paste inspection L 3Si-LS2 / LD2
IP-11b62261
Large size PCB’s
Single Lane / Dual Lane
Saki - 3D Solder paste inspection L 3Si-LS2 / LD2
IP-11b62261
Large size PCB’s
Single Lane / Dual Lane
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Hulp, installatie en/of training nodig?
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Nick Janssen
Product specialist
Description
Saki’s Large machine supports PCB sizes up to 500 W x 510 L mm , 19.68″ W x 20.07″ L in. The system is offered with your choice of three resolutions 7, 12 and 18 micron. Many design characteristcis are shared between our L size AOI and SPI systems including the frame, gantry, PC, GUI and others. This commonality minimizes spare parts inventory and requires less training.
Hardware providing high-speed and high-accurate inspection
– Shares the same rigid gantry structure with Saki’s 3Di-AOI
– Rigid gantry structure and exclusive dual Y axis motor drive system
– High resolution linear scale for accurate positioning
– CoaXPress camera delivers higher speed and higher accuracy measurement
Automatic Self-diagnostic functionality monitors machine performance
Hardware : Flexible Configurations for Wide Ranging Applications
– Simultaneous 2D and 3D inspection of the entire PCB surface
– Three sensors are available with 7μm, 12μm, and 18μm resolution
– Three machine sizes available including dual lane to support varying applications
Select from a variety of options including machine size, inspection resolution, hardware and software features to meet your specific requirements
Advanced Software Features
– Warpage management
– Coplanarity inspection
SPC Function
Specifications
| Size (W) x (D) x (H) [Main body]mm | 1040 x 1440 x 1500 |
| Weight Approx. | 900 Kg |
| Electric Power Requirement | Single-phase ~ 200-240V +/-10％, 50/60Hz |
| Resolution | 7μm, 12μm, 18μm |
| Air Requirement | 0.5MPa, 5L/min (ANR) |
| PCB Size | 7µm camera head: 50 W x 60 L - 330 W x 330 L |
| PCB Size | 12/18 µm camera head: 50 W x 60 L - 500 W x 510 L |
| PCB Clearance Top | 40mm, Bottom: 60mm |
Saki’s Large machine supports PCB sizes up to 500 W x 510 L mm , 19.68″ W x 20.07″ L in. The system is offered with your choice of three resolutions 7, 12 and 18 micron. Many design characteristcis are shared between our L size AOI and SPI systems including the frame, gantry, PC, GUI and others. This commonality minimizes spare parts inventory and requires less training.
Hardware providing high-speed and high-accurate inspection
– Shares the same rigid gantry structure with Saki’s 3Di-AOI
– Rigid gantry structure and exclusive dual Y axis motor drive system
– High resolution linear scale for accurate positioning
– CoaXPress camera delivers higher speed and higher accuracy measurement
Automatic Self-diagnostic functionality monitors machine performance
Hardware : Flexible Configurations for Wide Ranging Applications
– Simultaneous 2D and 3D inspection of the entire PCB surface
– Three sensors are available with 7μm, 12μm, and 18μm resolution
– Three machine sizes available including dual lane to support varying applications
Select from a variety of options including machine size, inspection resolution, hardware and software features to meet your specific requirements
Advanced Software Features
– Warpage management
– Coplanarity inspection
SPC Function
