Automatic Pick & Place Printer placeALL 520

The placeALL®520 is a modular Pick&Place system and especially useful to build prototypes and small series.

Automatic Pick & Place Printer placeALL 520

The placeALL®520 is a modular Pick&Place system and especially useful to build prototypes and small series.

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        • Onafhankelijke expertise
        • Klanten geven ons een 9+
        • Uitgebreid aanbod
        • Meer dan 45 jaar ervaring
        • Onafhankelijke expertise
        • Klanten geven ons een 9+
        • Uitgebreid aanbod
        • Meer dan 45 jaar ervaring
        Artikelnummer: SAEP-0fe73e9f Categorieën: , ,
        The placeALL®520 is a modular Pick&Place system and especially useful to build prototypes and small series.

        Beschrijving

        It supports a large range of components (chips, FP-components and BGAs), so even the most complex tasks can be handled.
        An intelligent software and up to 200 possbile kitting slots minimze changeover times, which increases productivity for small lot sizes.It is possible to integrate the fully automatic machine into a line on site at any time or to retrofit other options.

        Range of applications
        Assembling and dispensing of prototypes and zero series, up to 4000 components per hour.

        Feeding units
        Feeding of components from tape, stick, tape stripe, tray and loose components.

        Component capability
        Chips 0201 up to Fine Pitch 70 × 70 mm and pitch 0.4 mm, BGAs, CSPs, µBGAs, QFNs and customs parts like connectors, wired LEDs etc.

        Laser centering
        The laser centering is directly installed on the assembly head. The component which has to be centered is while rotating measured by the laser centering. Its shadow on the opposite side is analysed and a contactless fast centering happens. The component capability ranges from 0201 chips up to components with dimensions of 32 x 32 mm and Fine Pitch to 0.4 mm at PA520.
        BGAs can be centered in this way, too.
        The laser centering is also a method to determine the component dimensions like length, width and height.

        Bottom-Vision
        The bottom vision is an image recognition which measures and analyses the components that are too large for the centering at the head.
        The software for image recognition determines the exact assembling position and tests the BGAs of complete balls respectively that the FPs‘ wires aren‘t deformed. These components can be selected before processing. Used are components up to 0201, µBGAs, 0.3 mm Fine-Pitch or special components like for example connectors up to 70 x 70 mm.

        smartFEEDER
        smartFEEDER are intelligent feeders, that are equipped with a microprocessor control. Using a wireless barcode reader, reel- and feeder-barcode are programmed and saved in the software. The placeALL® Pick & Placer has now knowledge about the amount, type and position of the feeder. Thus changeover times between different projects are greatly reduced.

        Automatic fiducial recognition
        This extension recognizes the fiducials on a circuit board by itself. This is especially useful for a smartLINEsystem. The position correction is done using a dot, cross, rhomb etc. on the circuit board.
        While assembling multi-boards, single circuit boards – which are marked by the producer – can be excluded.

        Teach In
        If no CAD data is available to create a new assembly project, each position can be teached in manually.
        Therefore the component is displayed and aligned virtually. After reaching the right placing position on the monitor, it is approved and automatically added to the assembly project.

        CAD data converter
        With the universal CAD data converter, you can import data from all common CAD programs in a few simple steps.
        To ensure a high machine load on the Pick & Placer, the corresponding data files can be prepared using our offline software version on a separate workstation.

        Inline – system
        A classic production line can be built using our inline transport system. This includes chaining of reflow ovens, automatic Pick & Placers and transfer units like loaders. Controlling works acording to the SMEMA-Standard.
        The inline system can be retrofitted to the machine at the customer’s site at any time.

        Dispensers
        Dispensing of solder paste or glue can be done with two different systems:

        Time-pressure system
        For dispensing big solder paste dots or glue

        Microprocessor-controlled system
        This system detects parameters like cartridge temperature, fill level etc. .By this Fine-Pitch components down to a pitch of 0.5 mm can be safely dispensed, the ideal solution for prototypes!

        Specifications

        - 100 Slots for 8 or 12 mm single tape FEEDER
        - max. 200 Positions for 8 mm tapes
        - max. 1 assembling head
        - max. 2 dispensing heads
        - optional dividable machine frame
        - max. PCB size520 x 430
        - platform 1820 x 1425 x 1570 mm with FEEDER
        - standalone or inline

        It supports a large range of components (chips, FP-components and BGAs), so even the most complex tasks can be handled.
        An intelligent software and up to 200 possbile kitting slots minimze changeover times, which increases productivity for small lot sizes.It is possible to integrate the fully automatic machine into a line on site at any time or to retrofit other options.

        Range of applications
        Assembling and dispensing of prototypes and zero series, up to 4000 components per hour.

        Feeding units
        Feeding of components from tape, stick, tape stripe, tray and loose components.

        Component capability
        Chips 0201 up to Fine Pitch 70 × 70 mm and pitch 0.4 mm, BGAs, CSPs, µBGAs, QFNs and customs parts like connectors, wired LEDs etc.

        Laser centering
        The laser centering is directly installed on the assembly head. The component which has to be centered is while rotating measured by the laser centering. Its shadow on the opposite side is analysed and a contactless fast centering happens. The component capability ranges from 0201 chips up to components with dimensions of 32 x 32 mm and Fine Pitch to 0.4 mm at PA520.
        BGAs can be centered in this way, too.
        The laser centering is also a method to determine the component dimensions like length, width and height.

        Bottom-Vision
        The bottom vision is an image recognition which measures and analyses the components that are too large for the centering at the head.
        The software for image recognition determines the exact assembling position and tests the BGAs of complete balls respectively that the FPs‘ wires aren‘t deformed. These components can be selected before processing. Used are components up to 0201, µBGAs, 0.3 mm Fine-Pitch or special components like for example connectors up to 70 x 70 mm.

        smartFEEDER
        smartFEEDER are intelligent feeders, that are equipped with a microprocessor control. Using a wireless barcode reader, reel- and feeder-barcode are programmed and saved in the software. The placeALL® Pick & Placer has now knowledge about the amount, type and position of the feeder. Thus changeover times between different projects are greatly reduced.

        Automatic fiducial recognition
        This extension recognizes the fiducials on a circuit board by itself. This is especially useful for a smartLINEsystem. The position correction is done using a dot, cross, rhomb etc. on the circuit board.
        While assembling multi-boards, single circuit boards – which are marked by the producer – can be excluded.

        Teach In
        If no CAD data is available to create a new assembly project, each position can be teached in manually.
        Therefore the component is displayed and aligned virtually. After reaching the right placing position on the monitor, it is approved and automatically added to the assembly project.

        CAD data converter
        With the universal CAD data converter, you can import data from all common CAD programs in a few simple steps.
        To ensure a high machine load on the Pick & Placer, the corresponding data files can be prepared using our offline software version on a separate workstation.

        Inline – system
        A classic production line can be built using our inline transport system. This includes chaining of reflow ovens, automatic Pick & Placers and transfer units like loaders. Controlling works acording to the SMEMA-Standard.
        The inline system can be retrofitted to the machine at the customer’s site at any time.

        Dispensers
        Dispensing of solder paste or glue can be done with two different systems:

        Time-pressure system
        For dispensing big solder paste dots or glue

        Microprocessor-controlled system
        This system detects parameters like cartridge temperature, fill level etc. .By this Fine-Pitch components down to a pitch of 0.5 mm can be safely dispensed, the ideal solution for prototypes!

        Type

        Low Volume Mounter