Vapor Phase Soldering Machine VP2100 / VP2100 vacuum inline
Compact inline systems for serial production
Vapor Phase Soldering Machine VP2100 / VP2100 vacuum inline
Compact inline systems for serial production
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Nick Janssen
Product specialist
Beschrijving
Full inline integration and no need for workpiece carriers, this is the focus of ASSCON´s vapor phase inline soldering systems. The simple transfer and takeover of PCBs via pin chains characterize this type of inline system. Electrically width-adjustable transport systems allow fast and uncomplicated adaptation to changing products and thus offer the flexibility required in today’s modern electronics production. The integration into inline control computers is also possible. Full automation combined with the highest quality in the process is the guiding principle here.
With the patented Multi Vacuum technology, voids in solder joints are reduced and void rates <1% are achievable. The vacuum module, which can be switched on during the process, is located outside the soldering area (Clean Vacuum Technology) and is therefore extremely low in maintenance.
The soldering chamber has been enlarged to 750 x 620 mm. Both smaller assemblies up to a load of four in the batch and larger assemblies up to the maximum size of the soldering chamber can be processed.
Specifications
| Transportation type | |
| Single Lane | |
| Maximum solder format | |
| up to 750 x 620 mm | |
| Maximum PCB length - 2 PCB loading up to 370 mm | |
| Maximum PCB length - 3 PCB loading up to 235 mm | |
| Maximum PCB length - 4 PCB loading up to 165 mm | |
| Maximum component height at top | |
| 60 mm | |
| Connection load | |
| 9,6 kW | |
| Time to operation | |
| ca. 30 min |
Full inline integration and no need for workpiece carriers, this is the focus of ASSCON´s vapor phase inline soldering systems. The simple transfer and takeover of PCBs via pin chains characterize this type of inline system. Electrically width-adjustable transport systems allow fast and uncomplicated adaptation to changing products and thus offer the flexibility required in today’s modern electronics production. The integration into inline control computers is also possible. Full automation combined with the highest quality in the process is the guiding principle here.
With the patented Multi Vacuum technology, voids in solder joints are reduced and void rates <1% are achievable. The vacuum module, which can be switched on during the process, is located outside the soldering area (Clean Vacuum Technology) and is therefore extremely low in maintenance.
The soldering chamber has been enlarged to 750 x 620 mm. Both smaller assemblies up to a load of four in the batch and larger assemblies up to the maximum size of the soldering chamber can be processed.
| Type | Vapor Phase Soldering – Inline |
|---|
