Ersa - Rework system HR100
ERS-0IRHR100A
Non-contact gentle: Rework hand-guided or stationary
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Description
The HR 100 uses the revolutionary and patented Ersa Hybrid Rework technology to safely desolder and replace small SMDs. The medium wave IR radiation combined with a gentle hot air jet guarantees optimum energy transfer to the component.
The technology of Ersa rework systems ensures sustainable added value in electronics production:
- Gentle heating technology
- Sensor-guided soldering processes
- Precise component placement
- Complete process documentation
- Clear user guidance
Highlights HR100 Ersa Rework
- Patented hybrid rework technology (combination of IR heating technology and convection) for safe desoldering and soldering
- Optimum energy transfer and gentle heating of chip components 0201 up to 20 x 20 mm SMDs
- Interchangeable hybrid adapters of different sizes direct up to 200 W of heating energy specifically onto the component
- No blowing away of neighboring components
- Optionally with stand, 800 W IR underheating and PCB holder
- Vac Pen for safe handling of components
- IRSoft operating software
Specifications
| Dimensions (W x D x H) | 211 x 220 x 168 in mm |
| Weight | 4.5 kg |
| Antistatic Design | yes |
| Power Rating | 200 W |
| Nominal voltage | 230 in V AC |
| Upper heating | 200 W (Hybrid Tool) |
| Component size | 1 x 1 mm to 20 x 20 mm |
| Operation | One-touch operating button or Windows PC |
| Test symbol | CE |
The HR 100 uses the revolutionary and patented Ersa Hybrid Rework technology to safely desolder and replace small SMDs. The medium wave IR radiation combined with a gentle hot air jet guarantees optimum energy transfer to the component.
The technology of Ersa rework systems ensures sustainable added value in electronics production:
- Gentle heating technology
- Sensor-guided soldering processes
- Precise component placement
- Complete process documentation
- Clear user guidance
Highlights HR100 Ersa Rework
- Patented hybrid rework technology (combination of IR heating technology and convection) for safe desoldering and soldering
- Optimum energy transfer and gentle heating of chip components 0201 up to 20 x 20 mm SMDs
- Interchangeable hybrid adapters of different sizes direct up to 200 W of heating energy specifically onto the component
- No blowing away of neighboring components
- Optionally with stand, 800 W IR underheating and PCB holder
- Vac Pen for safe handling of components
- IRSoft operating software






