In-house Tech Days | Step-stencil & Printing Technologies
Due to great success, additional date: 8th of June!
Miniaturisation of small components
The increasing miniaturisation of small components combined with larger components and modules makes it increasingly challenging to provide the right paste volume for all components in one stencil.
Step-stencils
Step-Stencils can provide the necessary solutions for this, but there are also limitations to this technology. In collaboration with SMANS and Fineline QPI, Rotec has conducted research into these issues.
We are happy to share the results of this research with you at an In-House Tech Event on 6, 7 or 8 June 2023. During this day, the various challenges, process limits and possible solutions will be explained in detail.
Practical
The event will take place from 10am to 3pm with a lunch break between 12pm and 1pm
The following sessions & topics will be covered on the day:
09h00 – 10h00: | Welcome coffee |
10h00 – 11h30: | Step Stencil Technology (Rotec) Awareness, challenges, limitation, solutions |
11h30 – 12h00: | Fine pitch components and PCB related issues (Fineline QPI) |
12h00 – 13h00: | Lunch |
13h00 – 14h30: | Accuracy, stability, calibration (Smans & SAKI) |
14h30 – 15h00: | Troubleshooting & Tools (Rotec) Accuracy Measurement Tools Ultra Fine Feature Printing Under Stencil Cleaning |
15h00 – …: | End and closing drink |
Location
Smans Technology Center
Bremheidelaan 8
B-2300 Turnhout
[button link=’https://www.flexmail.eu/f-faae6801b5e24814′]Register here[/button]