The THT Pick & Place systems ensure fast, accurate placement of through-hole components on the printed circuit board. Where manual insertion can be time-consuming and error-prone, these systems guarantee consistent quality and high production speeds. Thanks to intelligent vision systems and automatic component feeding, even complex layouts with a wide variety of component shapes can be processed efficiently.
The advantages:
THT Pick & Place is therefore the ideal link between component preparation and soldering automation.
Wave soldering is the standard solution for the efficient processing of large numbers of THT components. The underside of the printed circuit board is guided through a controlled solder wave so that all connections are formed in a single process step. Modern wave soldering systems with a nitrogen atmosphere reduce oxidation, improve soldering quality, and limit flux consumption.
Features of professional wave soldering technology:
For printed circuit boards with mixed THT and SMD components, selective soldering offers the perfect solution. Here, only specific solder points are heated and soldered using a mini or multiwave technique. This keeps the thermal load to a minimum and the soldering quality optimal.
Advantages of selective soldering:
Selective soldering combines precision, process control, and flexibility—an indispensable step for modern, demanding electronics production.
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