Fritsch - Manual Pick & Place Machine LM901

FRI-90111001

The LM901 is the entry model of our modular-built systems.

Fritsch - Manual Pick & Place Machine LM901

FRI-90111001

The LM901 is the entry model of our modular-built systems.

4.959,29 - Not in stock

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Do you want to expand or replace your machine park? This is possible via Smans. Consider a manual, semi-automatic machine or a fully automated production line. We work together with reliable leasing partners. They offer flexible and reliable tailor-made business financing solutions. 

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The benefits of leasing through Smans:

  • financial space/maintenance of liquid assets;
  • for both large and small investments;
  • promote your growth and increase your capacity;
  • strengthen your competitive position through an up-to-date machine park.

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    • Independent expertise
    • Customers give us a 9+
    • Extensive offer
    • More than 45 years of experience

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      • Independent expertise
      • Customers give us a 9+
      • Extensive offer
      • More than 45 years of experience
      • Independent expertise
      • Customers give us a 9+
      • Extensive offer
      • More than 45 years of experience
      SKU: FRI-90111001 Categories: , ,

      Description

      The LM901 is the entry model of our modular-built systems. Besides the LM900 functionality, it can be extended with axis brakesdispensers and optical support systems for component placing.
      The LM901 supports the whole dispensing-/ Pick & Place – process, from supplying the solder paste or glue to placing standard, Fine-Pitch or BGA components.

      Specifications

      Placement rate300 - 600 SMDs per hour
      Dimensions700 x 680 x 340 mm
      Max. PCB size550 x 310 mm
      Max. placement area425 x 310 mm
      PCB thickness0,5 mm - 4 mm

      The LM901 is the entry model of our modular-built systems. Besides the LM900 functionality, it can be extended with axis brakesdispensers and optical support systems for component placing.
      The LM901 supports the whole dispensing-/ Pick & Place – process, from supplying the solder paste or glue to placing standard, Fine-Pitch or BGA components.