Ersa - Stencil Printer VERSAPRINT 2 ULTRA³
SAEP-eb71b0fb
The world’s first stencil printer with fully integrated 3D SPI inspection, seamlessly combining the printing and inspection processes in a single machine.
Ersa - Stencil Printer VERSAPRINT 2 ULTRA³
SAEP-eb71b0fb
The world’s first stencil printer with fully integrated 3D SPI inspection, seamlessly combining the printing and inspection processes in a single machine.
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Description
The VERSAPRINT 2 ULTRA³ has been developed for the most demanding SMT production lines where volume, height, position, and offset of solder paste prints must be precisely controlled. Thanks to advanced 3D LIST line scan camera technology, the machine can measure the height profiles of each solder paste relief – not just coverage or position, but also whether the paste runs off at the edges or is completely uniform, for example.
The integrated inspection takes place immediately after printing, allowing the machine to function as both a stencil printer and a 100% SPI system in one. This offers several advantages: less floor space is required than for separate printing and inspection machines, the process is fully centralized under a single control system, and the closed-loop function can automatically send offset corrections to the print head for optimal printing results.
With a substrate capacity of minimum 50 × 50 mm to maximum 680 × 500 mm (inspection area up to approximately 550 × 500 mm) and a print head with two independent squeegee units with continuous pressure control (0-230 N), the machine delivers excellent repeatability (±12.5 µm) and print accuracy (±25 µm) within short cycle times (approximately 10 s + print).
Essentially, the VERSAPRINT 2 ULTRA³ is a future-proof investment for manufacturers striving for maximum quality, minimal process risks, and integrated inspection without additional footprint.
Specifications
| Print head | two independent squeegee heads with continuous squeegee force control, squeegee depth stop and pendulum limitation |
| Cycle time | 10 s + print |
| Optional stencil cleaner | 680 x 500 mm |
| Squeegee force | 0-230 N |
| Setup time | under 10 min |
| Substrate thickness | 0.5-6 mm |
| Camera | 3D line scan camera for alignment and inspection of substrate and stencil |
| Product changeover | under 2 min |
| Component clearance | up to 35 mm |
| Repeatability | +/-12.5 µm @ 6 sigma |
| Stencil dimensions | min. 450 x 450 mm, max. 737 x 737 mm adjustable without tools |
| Print accuracy | +/-25 µm @ 6 sigma |
| Graphical user interface | touch screen |
Downloads
The VERSAPRINT 2 ULTRA³ has been developed for the most demanding SMT production lines where volume, height, position, and offset of solder paste prints must be precisely controlled. Thanks to advanced 3D LIST line scan camera technology, the machine can measure the height profiles of each solder paste relief – not just coverage or position, but also whether the paste runs off at the edges or is completely uniform, for example.
The integrated inspection takes place immediately after printing, allowing the machine to function as both a stencil printer and a 100% SPI system in one. This offers several advantages: less floor space is required than for separate printing and inspection machines, the process is fully centralized under a single control system, and the closed-loop function can automatically send offset corrections to the print head for optimal printing results.
With a substrate capacity of minimum 50 × 50 mm to maximum 680 × 500 mm (inspection area up to approximately 550 × 500 mm) and a print head with two independent squeegee units with continuous pressure control (0-230 N), the machine delivers excellent repeatability (±12.5 µm) and print accuracy (±25 µm) within short cycle times (approximately 10 s + print).
Essentially, the VERSAPRINT 2 ULTRA³ is a future-proof investment for manufacturers striving for maximum quality, minimal process risks, and integrated inspection without additional footprint.
| Type | Standard Board Size Printer |
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