Fritsch SMT - Convection Reflow Soldering System MRO250

FRI-903250

Batch soldering system for printed circuit boards up to 350 x 250 mm

Fritsch SMT - Convection Reflow Soldering System MRO250

FRI-903250

Batch soldering system for printed circuit boards up to 350 x 250 mm

2 - 6 weeks
Price on request

Price request

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    • Independent expertise
    • Customers give us a 9+
    • Extensive offer
    • More than 50 years of experience

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      • Independent expertise
      • Customers give us a 9+
      • Extensive offer
      • More than 50 years of experience

      Need a quote, installation, or training?
      Call +32 (0)14 42 44 01 or contact us

      Contact us

      In need direct contact with a sales representative?

      Nick Janssen

      Product specialist

        Or leave your details and we will contact you as soon as possible.


        • Independent expertise
        • Customers give us a 9+
        • Extensive offer
        • More than 50 years of experience
        • Independent expertise
        • Customers give us a 9+
        • Extensive offer
        • More than 50 years of experience

        Description

        The reflow-soldering of SMD assembled components and the curing process are easy and economic by the use of the Batch-Oven.

        The compact size and extremely good value of the Convection Reflow Soldering System makes Surface Mount Reflowing viable even for very small batch sizes.

        Specifications

        Dimensions590 x 260 x 430 mm
        Long-time process (e. g. b. cure adhesive)50 - 180°C, 1 - 300 min.
        Max. PCB size350 x 250 mm
        Preheating-temperature / time50 - 240°C, 1 - 3600 sec.
        Reflow-temperature / time75 - 320°C, 1 - 600 sec.

        The reflow-soldering of SMD assembled components and the curing process are easy and economic by the use of the Batch-Oven.

        The compact size and extremely good value of the Convection Reflow Soldering System makes Surface Mount Reflowing viable even for very small batch sizes.