In times when energy is very expensive and we need to take care of the environment, it is worth taking a close look at your existing processes. Many electronics assembly companies use the conventional convection system (reflow) as their soldering process for SMD/SMT components.
However, the vapour phase process offers a perfect alternative with the advantage that it requires up to 75% less electrical power. A huge gain for nature and for your wallet. The same applies to the THT soldering process, by switching from wave soldering to selective soldering.
In-line solutions
But isn’t vapour phase very slow? It can certainly be said that this process is somewhat slower than the conventional convection system. If we look at the in-line solutions from ASSCON Systemtechnik Electronics GmbH, they come pretty close in terms of turnaround time.
For many electronics manufacturing companies in the Benelux, the speed
of these in-line systems is more than sufficient and therefore perfectly suitable as a replacement or supplement to the reflow process.
Advantages of the vapour phase process
Soldering with vapour phase ensures gradual and efficient heating of the assemblies, regardless of their thermal mass. The process fluid Galden® generates a vapour zone in which the product is brought to temperature by condensing the vapour. The condensation film that forms around the assemblies prevents any oxidation during the entire heating and soldering process!
The physically limited maximum temperature of the process corresponds to the vapour point of the medium, thus preventing overheating of components and boards. Different boiling points and thus process temperatures of up to 260 °C can be achieved depending on the type of Galden® selected.
