Fritsch - Automatic Pick & Place Printer placeALL 620
FRI-908620100
The placeALL®620 has a modular structure and can be used for the assembly of small up to medium series.
Fritsch - Automatic Pick & Place Printer placeALL 620
FRI-908620100
The placeALL®620 has a modular structure and can be used for the assembly of small up to medium series.
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Description
With a wide range of handled components, ranging from chips model 0201 up to 70 x 70 FP-parts with a pitch of 0.3 mm and BGAs, even complex tasks can be flexibly assembled. With a maximum of 208 possible feeder positions and a intelligent software, changeover times can be reduced to a minimum. Additionally the placeALL® machines can be integrated into an assembly inline-system (like our smartLINE), which can be operated according to the SMEMA standard. Range of applications Assembling and dispensing of low and medium volume SMT, up to 10500 (two heads) 6000 (4600 / IPC9850) components per hour. Feeding units Feeding of components from tape, stick, tape stripe, tray and loose components. Component capability Chips 0201 up to Fine Pitch 70 × 70 mm and pitch 0.3 mm, BGAs, µBGAs, CSPs, QFNs and custom parts like connectors, wired THT-LEDs etc. Bottom-Vision The bottom vision is an image recognition which measures and analyses the components that are too large for the centering at the head. The software for image recognition determines the exact assembling position and tests the BGAs of complete balls respectively that the FPs‘ wires aren‘t deformed. These components can be selected before processing. Used are components up to 0201, µBGAs, 0.3 mm Fine-Pitch or special components like for example connectors up to 70 x 70 mm. smartFEEDER smartFEEDER are intelligent feeders, that are equipped with a microprocessor control. Using a wireless barcode reader, reel- and feeder-barcode are programmed and saved in the software. The placeALL® Pick & Placer has now knowledge about the amount, type and position of the feeder. Thus changeover times between different projects are greatly reduced. Automatic fiducial recognition This extension recognizes the fiducials on a circuit board by itself. This is especially useful for a smartLINEsystem. The position correction is done using a dot, cross, rhomb etc. on the circuit board. While assembling multi-boards, single circuit boards – which are marked by the producer – can be excluded. Double head According to the motto „grow with the times“, a second placement head and tool changer can be retrofitted to the placeALL®620, placeALL®620L and 610XL. This allows the placement speed to be increased up to 40 %. Compared to investing in a second machine the additional costs are just a fraction. Inline – system A classic production line can be built using our inline transport system. This includes chaining of reflow ovens, automatic Pick & Placers and transfer units like loaders. Controlling works acording to the SMEMA-Standard. The inline system can be retrofitted to the machine at the customer’s site at any time. Dispensers Dispensing of solder paste or glue can be done with two different systems: Time-pressure system For dispensing big solder paste dots or glue Microprocessor-controlled system This system detects parameters like cartridge temperature, fill level etc. .By this Fine-Pitch components down to a pitch of 0.5 mm can be safely dispensed, the ideal solution for prototypes!
With a wide range of handled components, ranging from chips model 0201 up to 70 x 70 FP-parts with a pitch of 0.3 mm and BGAs, even complex tasks can be flexibly assembled. With a maximum of 208 possible feeder positions and a intelligent software, changeover times can be reduced to a minimum. Additionally the placeALL® machines can be integrated into an assembly inline-system (like our smartLINE), which can be operated according to the SMEMA standard. Range of applications Assembling and dispensing of low and medium volume SMT, up to 10500 (two heads) 6000 (4600 / IPC9850) components per hour. Feeding units Feeding of components from tape, stick, tape stripe, tray and loose components. Component capability Chips 0201 up to Fine Pitch 70 × 70 mm and pitch 0.3 mm, BGAs, µBGAs, CSPs, QFNs and custom parts like connectors, wired THT-LEDs etc. Bottom-Vision The bottom vision is an image recognition which measures and analyses the components that are too large for the centering at the head. The software for image recognition determines the exact assembling position and tests the BGAs of complete balls respectively that the FPs‘ wires aren‘t deformed. These components can be selected before processing. Used are components up to 0201, µBGAs, 0.3 mm Fine-Pitch or special components like for example connectors up to 70 x 70 mm. smartFEEDER smartFEEDER are intelligent feeders, that are equipped with a microprocessor control. Using a wireless barcode reader, reel- and feeder-barcode are programmed and saved in the software. The placeALL® Pick & Placer has now knowledge about the amount, type and position of the feeder. Thus changeover times between different projects are greatly reduced. Automatic fiducial recognition This extension recognizes the fiducials on a circuit board by itself. This is especially useful for a smartLINEsystem. The position correction is done using a dot, cross, rhomb etc. on the circuit board. While assembling multi-boards, single circuit boards – which are marked by the producer – can be excluded. Double head According to the motto „grow with the times“, a second placement head and tool changer can be retrofitted to the placeALL®620, placeALL®620L and 610XL. This allows the placement speed to be increased up to 40 %. Compared to investing in a second machine the additional costs are just a fraction. Inline – system A classic production line can be built using our inline transport system. This includes chaining of reflow ovens, automatic Pick & Placers and transfer units like loaders. Controlling works acording to the SMEMA-Standard. The inline system can be retrofitted to the machine at the customer’s site at any time. Dispensers Dispensing of solder paste or glue can be done with two different systems: Time-pressure system For dispensing big solder paste dots or glue Microprocessor-controlled system This system detects parameters like cartridge temperature, fill level etc. .By this Fine-Pitch components down to a pitch of 0.5 mm can be safely dispensed, the ideal solution for prototypes!
Type | Low Volume Mounter |
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