Automatic Pick & Place Printer placeALL 620L

The placeALL®620L is built modular and has a larger placement area than the placeALL®620.

Automatic Pick & Place Printer placeALL 620L

The placeALL®620L is built modular and has a larger placement area than the placeALL®620.

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    • Extensive offer
    • More than 45 years of experience

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      • Independent expertise
      • Customers give us a 9+
      • Extensive offer
      • More than 45 years of experience

      Contact us

      In need direct contact with a sales representative?

      Nick Janssen

      Product specialist

        Or leave your details and we will contact you as soon as possible.

        • Independent expertise
        • Customers give us a 9+
        • Extensive offer
        • More than 45 years of experience
        • Independent expertise
        • Customers give us a 9+
        • Extensive offer
        • More than 45 years of experience
        SKU: SAEP-8bd737b6 Categories: , ,
        The placeALL®620L is built modular and has a larger placement area than the placeALL®620.

        Description

        The wide range of handled components from 0201 chips up to FP parts with 0.3 mm pitch and BGAs allows the flexible assembly of even complex projects.
        With 284 feeder positions and an intelligent software, changeover times can be reduced to a minimum.
        Additionally, the whole placement area can be used to assemble large circuit boards (up to 910 × 430 mm).

        Range of applications
        Assembling and dispensing of low and medium volume SMT up to 10500 (two heads) 6000 (4600 / IPC9850) components per hour.

        Feeding units
        Feeding of components from tape, stick, tape stripe, tray and loose components.

        Component capability
        Chips 0201 up to Fine Pitch 70 × 70 mm and pitch 0.3 mm, BGAs, µBGAs, CSPs, QFNs and custom parts like connectors, wired THT-LEDs etc.

        Bottom-Vision
        The bottom vision is an image recognition which measures and analyses the components that are too large for the centering at the head.
        The software for image recognition determines the exact assembling position and tests the BGAs of complete balls respectively that the FPs‘ wires aren‘t deformed. These components can be selected before processing. Used are components up to 0201, µBGAs, 0.3 mm Fine-Pitch or special components like for example connectors up to 70 x 70 mm.

        smartFEEDER
        smartFEEDER are intelligent feeders, that are equipped with a microprocessor control. Using a wireless barcode reader, reel- and feeder-barcode are programmed and saved in the software. The placeALL® Pick & Placer has now knowledge about the amount, type and position of the feeder. Thus changeover times between different projects are greatly reduced.

        Automatic fiducial recognition
        This extension recognizes the fiducials on a circuit board by itself. This is especially useful for a smartLINEsystem. The position correction is done using a dot, cross, rhomb etc. on the circuit board.
        While assembling multi-boards, single circuit boards – which are marked by the producer – can be excluded.

        Double head
        According to the motto „grow with the times“, a second placement head and tool changer can be retrofitted to the placeALL®620, placeALL®620L and 610XL. This allows the placement speed to be increased up to 40 %. Compared to investing in a second machine the additional costs are just a fraction.

        Inline – system
        A classic production line can be built using our inline transport system. This includes chaining of reflow ovens, automatic Pick & Placers and transfer units like loaders. Controlling works acording to the SMEMA-Standard.
        The inline system can be retrofitted to the machine at the customer’s site at any time.

        Dispensers
        Dispensing of solder paste or glue can be done with two different systems:

        Time-pressure system
        For dispensing big solder paste dots or glue

        Microprocessor-controlled system
        This system detects parameters like cartridge temperature, fill level etc. .By this Fine-Pitch components down to a pitch of 0.5 mm can be safely dispensed, the ideal solution for prototypes!

        Specifications

        Type

        The wide range of handled components from 0201 chips up to FP parts with 0.3 mm pitch and BGAs allows the flexible assembly of even complex projects.
        With 284 feeder positions and an intelligent software, changeover times can be reduced to a minimum.
        Additionally, the whole placement area can be used to assemble large circuit boards (up to 910 × 430 mm).

        Range of applications
        Assembling and dispensing of low and medium volume SMT up to 10500 (two heads) 6000 (4600 / IPC9850) components per hour.

        Feeding units
        Feeding of components from tape, stick, tape stripe, tray and loose components.

        Component capability
        Chips 0201 up to Fine Pitch 70 × 70 mm and pitch 0.3 mm, BGAs, µBGAs, CSPs, QFNs and custom parts like connectors, wired THT-LEDs etc.

        Bottom-Vision
        The bottom vision is an image recognition which measures and analyses the components that are too large for the centering at the head.
        The software for image recognition determines the exact assembling position and tests the BGAs of complete balls respectively that the FPs‘ wires aren‘t deformed. These components can be selected before processing. Used are components up to 0201, µBGAs, 0.3 mm Fine-Pitch or special components like for example connectors up to 70 x 70 mm.

        smartFEEDER
        smartFEEDER are intelligent feeders, that are equipped with a microprocessor control. Using a wireless barcode reader, reel- and feeder-barcode are programmed and saved in the software. The placeALL® Pick & Placer has now knowledge about the amount, type and position of the feeder. Thus changeover times between different projects are greatly reduced.

        Automatic fiducial recognition
        This extension recognizes the fiducials on a circuit board by itself. This is especially useful for a smartLINEsystem. The position correction is done using a dot, cross, rhomb etc. on the circuit board.
        While assembling multi-boards, single circuit boards – which are marked by the producer – can be excluded.

        Double head
        According to the motto „grow with the times“, a second placement head and tool changer can be retrofitted to the placeALL®620, placeALL®620L and 610XL. This allows the placement speed to be increased up to 40 %. Compared to investing in a second machine the additional costs are just a fraction.

        Inline – system
        A classic production line can be built using our inline transport system. This includes chaining of reflow ovens, automatic Pick & Placers and transfer units like loaders. Controlling works acording to the SMEMA-Standard.
        The inline system can be retrofitted to the machine at the customer’s site at any time.

        Dispensers
        Dispensing of solder paste or glue can be done with two different systems:

        Time-pressure system
        For dispensing big solder paste dots or glue

        Microprocessor-controlled system
        This system detects parameters like cartridge temperature, fill level etc. .By this Fine-Pitch components down to a pitch of 0.5 mm can be safely dispensed, the ideal solution for prototypes!

        Type